H05K 3/4617
Characterized by laminating only or mainly similar single-sided circuit boards
Official title: {characterized by laminating only or mainly similar single-sided circuit boards}
H05K3/4617 (Characterized by laminating only or mainly similar single-sided circuit boards) appears on 367 US grants and 342 published applications in this corpus.
Search patents in H05K- Granted patents
- 367
- Published applications
- 342
- Assignees
- 143
- Inventors
- 709
- Latest grant
- 1 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 2 | 0 |
| 1989 | 0 | 0 |
| 1990 | 1 | 0 |
| 1991 | 2 | 0 |
| 1992 | 1 | 0 |
| 1993 | 5 | 0 |
| 1994 | 11 | 0 |
| 1995 | 4 | 0 |
| 1996 | 3 | 0 |
| 1997 | 2 | 0 |
| 1998 | 5 | 0 |
| 1999 | 10 | 0 |
| 2000 | 9 | 0 |
| 2001 | 8 | 6 |
| 2002 | 11 | 16 |
| 2003 | 20 | 20 |
| 2004 | 19 | 31 |
| 2005 | 23 | 16 |
| 2006 | 8 | 18 |
| 2007 | 20 | 12 |
| 2008 | 12 | 17 |
| 2009 | 3 | 15 |
| 2010 | 11 | 10 |
| 2011 | 12 | 12 |
| 2012 | 13 | 7 |
| 2013 | 8 | 8 |
| 2014 | 8 | 13 |
| 2015 | 7 | 17 |
| 2016 | 14 | 13 |
| 2017 | 19 | 13 |
| 2018 | 16 | 17 |
| 2019 | 16 | 15 |
| 2020 | 16 | 18 |
| 2021 | 13 | 11 |
| 2022 | 10 | 10 |
| 2023 | 9 | 5 |
| 2024 | 7 | 7 |
| 2025 | 5 | 4 |
| 2026 | 3 | 11 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Membrane circuit board1 Sep 2026US 12,727,079 B2Chicony Electronics Co., Ltd.
- Method of manufacturing circuit board12 May 2026US 12,628,282 B2Avary Holding (Shenzhen) Co., Limited.
- Printed circuit board and printing apparatus10 Feb 2026US 12,550,248 B2Canon Kabushiki Kaisha
- Method for producing layered body, layered body, and multilayered body2 Dec 2025US 12,489,044 B2Toyobo Co., Ltd.
- Multilayer board, electronic device, and multilayer board inspection method21 Oct 2025US 12,451,284 B2Murata Manufacturing Co., Ltd.
- Circuit board assembly with embedded electronic devices and method for manufacturing the same6 Aug 2026US 2026/0231338 A1Avary Holding (Shenzhen) Co., Limited.
- Component carrier and method for manufacturing a component carrier14 May 2026US 2026/0136463 A1AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Resin laminated board and method for manufacturing resin laminated board26 Mar 2026US 2026/0089834 A1Murata Manufacturing Co., Ltd.
- Electronic device and manufacturing method thereof26 Feb 2026US 2026/0059664 A1Innolux Corporation
- Multilayer substrate, cable, and electronic apparatus19 Feb 2026US 2026/0052626 A1Murata Manufacturing Co., Ltd.
Most cited
By later US patents
- Multilayer printed-circuit board and semiconductor device174US 6,534,723 B1Ibiden Co., Ltd. · 2003
- Circuit component built-in module and method for producing the same156US 6,038,133 AMatsushita Electric Industrial Co., Ltd. · 2000
- Semiconductor device and method for manufacturing substrate of the same147US 6,351,031 B1Fujitsu Limited · 2002
- Manufacturing methods for printed circuit boards142US 6,902,869 B2International Business Machines Corporation · 2005
- Method of manufacturing a multilayer circuit board138US 5,046,238 ARogers Corporation · 1991