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US 2026/0052626 A1Published application
Multilayer substrate, cable, and electronic apparatus
AssigneeMurata Manufacturing Co., Ltd.
InventorsIppei HATSUDA, Noriaki OKUDA, Masahiro KUROKAWA
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Abstract
A multilayer substrate includes a multilayer body including an insulator layer and a conductor layer that are stacked. The multilayer body includes a bent portion and a bent-portion continuation portion continuous with the bent portion. The multilayer body includes, in a portion of the bent portion, a protrusion protruding toward an inside of a bend of the bent portion.
Claims20
A multilayer substrate comprising:
- a multilayer body including an insulator layer and a conductor layer that are stacked;
- wherein
- the multilayer body includes a bent portion and a bent-portion continuation portion continuous with the bent portion;
- and
- the multilayer body includes, in a portion of the bent portion, a protrusion protruding toward an inside of a bend of the bent portion.
2 more elements
Dependencies are inferred from the claim text.