H05K 3/462
Characterized by laminating only or mainly similar double-sided circuit boards
Official title: {characterized by laminating only or mainly similar double-sided circuit boards}
H05K3/462 (Characterized by laminating only or mainly similar double-sided circuit boards) appears on 345 US grants and 311 published applications in this corpus.
Search patents in H05K- Granted patents
- 345
- Published applications
- 311
- Assignees
- 131
- Inventors
- 727
- Latest grant
- 19 May 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 1 | 0 |
| 1986 | 1 | 0 |
| 1987 | 2 | 0 |
| 1988 | 2 | 0 |
| 1989 | 1 | 0 |
| 1990 | 0 | 0 |
| 1991 | 1 | 0 |
| 1992 | 4 | 0 |
| 1993 | 4 | 0 |
| 1994 | 10 | 0 |
| 1995 | 13 | 0 |
| 1996 | 14 | 0 |
| 1997 | 7 | 0 |
| 1998 | 16 | 0 |
| 1999 | 11 | 0 |
| 2000 | 10 | 0 |
| 2001 | 17 | 11 |
| 2002 | 9 | 17 |
| 2003 | 12 | 17 |
| 2004 | 18 | 24 |
| 2005 | 12 | 11 |
| 2006 | 7 | 12 |
| 2007 | 15 | 24 |
| 2008 | 8 | 24 |
| 2009 | 8 | 21 |
| 2010 | 10 | 17 |
| 2011 | 16 | 16 |
| 2012 | 12 | 15 |
| 2013 | 8 | 4 |
| 2014 | 8 | 15 |
| 2015 | 8 | 6 |
| 2016 | 12 | 7 |
| 2017 | 7 | 3 |
| 2018 | 8 | 8 |
| 2019 | 5 | 11 |
| 2020 | 13 | 7 |
| 2021 | 3 | 8 |
| 2022 | 13 | 10 |
| 2023 | 5 | 7 |
| 2024 | 7 | 5 |
| 2025 | 2 | 9 |
| 2026 | 3 | 2 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Component carrier19 May 2026US 12,635,073 B2AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Method of manufacturing circuit board12 May 2026US 12,628,282 B2Avary Holding (Shenzhen) Co., Limited.
- Carrier assembly and method for producing a carrier assembly21 Apr 2026US 12,610,474 B2AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Package component1 Jul 2025US 12,349,268 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Laminated wiring board27 May 2025US 12,317,426 B2Shinko Electric Industries Co., Ltd.
- Component Carrier13 Aug 2026US 2026/0239534 A1AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Wiring board, electronic component mounting package including wiring board, and electronic module26 Feb 2026US 2026/0059654 A1KYOCERA Corporation
- Method for manufacturing multilayer substrate27 Nov 2025US 2025/0365869 A1Fict Limited
- Substrate structure13 Nov 2025US 2025/0349681 A1Unimicron Technology Corp.
- Substrate structure13 Nov 2025US 2025/0351272 A1Unimicron Technology Corp.
Most cited
By later US patents
- Component built-in module and method for producing the same277US 6,734,542 B2Matsushita Electric Industrial Co., Ltd. · 2004
- High density circuit board and method of making same275US 5,191,174 AInternational Business Machines Corporation · 1993
- Parallel process interposer (PPI)263US 5,404,044 AInternational Business Machines Corporation · 1995
- Interconnection method and structure for organic circuit boards248US 5,435,057 AInternational Business Machines Corporation · 1995
- Planar redistribution structure and printed wiring device239US 5,774,340 AInternational Business Machines Corporation · 1998