Laminated wiring board

A laminated wiring board comprising:

• a plurality of first wiring boards laminated on one another;
• a first insulating resin layer disposed between two adjacent first wiring boards among the plurality of first wiring boards;
• and
• a second insulating resin layer configured to cover side surfaces of the plurality of first wiring boards, wherein:
• each first wiring board among the plurality of first wiring boards includes a core layer having an upper surface and a lower surface, a first laminate having a plurality of interconnect layers and a plurality of insulating layers alternately laminated on the upper surface of the core, and a second laminate having a plurality of interconnect layers and a plurality of insulating layers alternately laminated on the lower surface of the core layer,
• at least one interconnect layer among the plurality of interconnect layers in each of the first laminate and the second laminate includes an interconnect pattern and a via interconnect, and
• interconnect patterns of the two adjacent first wiring boards are mechanically bonded via a first conductive bonding material.