Substrate structure

A substrate structure, comprising:

• a first substrate, having a first surface and a second surface opposite to each other and comprising at least one first conductive via, at least one first pad, at least one second pad, a plurality of first nano-metal wires, and a plurality of second nano-metal wires, wherein the at least one first pad and the at least one second pad are respectively located on the first surface and the second surface and are connected to the at least one first conductive via, the first nano-metal wires are disposed on the at least one first pad, and the second nano-metal wires are disposed on the at least one second pad;
• a second substrate, disposed on the first surface of the first substrate and comprising at least one third pad facing the first surface, a plurality of third nano-metal wires disposed on the at least one third pad, and at least one second conductive via connecting the at least one third pad;
• a third substrate, disposed on the second surface of the first substrate and comprising at least one fourth pad facing the second surface, a plurality of fourth nano-metal wires disposed on the at least one fourth pad, and at least one third conductive via connecting the at least one fourth pad;
• and
• an electroless metal material, directly covering the at least one first pad, the first nano-metal wires, the at least one third pad, the third nano-metal wires, the at least one second pad, the second nano-metal wires, the at least one fourth pad, and the fourth nano-metal wires, wherein the at least one first pad is electrically connected to the at least one third pad through the electroless metal material, and the at least one second pad is electrically connected to the at least one fourth pad through the electroless metal material.