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US 2026/0164555 A1Published application
Carrier substrate and manufacturing method thereof
AssigneeAaltoSemi Inc.
InventorsYin-Ju CHEN, Min-Yao CHEN, Sung-Kun LIN
Life of this patent
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Abstract
Provided are a carrier substrate and a manufacturing method thereof. A carrier substrate is made by stacking a plurality of glass board structures to form a composite board having through holes, the wiring layers are formed on surfaces of opposite sides of the composite board, and conductive pillars electrically connected to the wiring layers are formed in the through holes. Therefore, by stacking the multiple thinner glass board structures, the composite board that meets the thinning requirements can be manufactured.
Claims20
A carrier substrate, comprising:
- a plurality of first board structures containing silicon and having a plurality of first vias;
- a second board structure containing silicon and having a plurality of second vias;
- a third board structure containing silicon and having a plurality of third vias, wherein the plurality of first board structures, the second board structure and the third board structure are stacked to form a composite board, the plurality of first board structures are positioned between the second board structure and the third board structure, and each of the first vias, the second vias and the third vias are correspondingly connected to each other to form a through hole;
- wiring layers formed on two opposite sides of the composite board;
- and
- a plurality of conductive pillars each formed in the through hole and electrically connected to the wiring layers.
3 more elements
A method of manufacturing a carrier substrate, comprising:
- providing a plurality of first board structures containing silicon and having a plurality of first vias, a second board structure containing silicon and having a plurality of second vias and a third board structure containing silicon and having a plurality of third vias;
- stacking the plurality of first board structures, the second board structure and the third board structure to form a composite board, wherein the plurality of first board structures are interposed between the second board structure and the third board structure, and each of the first vias, the second vias and the third vias are connected to each other to form a through hole;
- and
- forming wiring layers on two of opposite sides of the composite board, and forming at least one conductive pillar electrically connected to the wiring layers in the through hole.
1 more element
Dependencies are inferred from the claim text.