H05K 3/0058
Laminating printed circuit boards onto other substrates
Official title: {Laminating printed circuit boards onto other substrates, e.g. metallic substrates (H05K1/0281 takes precedence)}
H05K3/0058 (Laminating printed circuit boards onto other substrates) appears on 2,250 US grants and 2,301 published applications in this corpus.
Search patents in H05K- Granted patents
- 2,250
- Published applications
- 2,301
- Assignees
- 1,118
- Inventors
- 5,394
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 4 | 0 |
| 1978 | 5 | 0 |
| 1979 | 3 | 0 |
| 1980 | 8 | 0 |
| 1981 | 2 | 0 |
| 1982 | 3 | 0 |
| 1983 | 4 | 0 |
| 1984 | 6 | 0 |
| 1985 | 5 | 0 |
| 1986 | 13 | 0 |
| 1987 | 14 | 0 |
| 1988 | 11 | 0 |
| 1989 | 14 | 0 |
| 1990 | 22 | 0 |
| 1991 | 16 | 0 |
| 1992 | 21 | 0 |
| 1993 | 22 | 0 |
| 1994 | 25 | 0 |
| 1995 | 26 | 0 |
| 1996 | 27 | 0 |
| 1997 | 44 | 0 |
| 1998 | 52 | 0 |
| 1999 | 50 | 0 |
| 2000 | 40 | 0 |
| 2001 | 65 | 15 |
| 2002 | 60 | 49 |
| 2003 | 50 | 63 |
| 2004 | 51 | 78 |
| 2005 | 44 | 93 |
| 2006 | 47 | 131 |
| 2007 | 68 | 125 |
| 2008 | 78 | 142 |
| 2009 | 81 | 133 |
| 2010 | 101 | 158 |
| 2011 | 101 | 110 |
| 2012 | 92 | 82 |
| 2013 | 78 | 109 |
| 2014 | 81 | 107 |
| 2015 | 72 | 88 |
| 2016 | 79 | 95 |
| 2017 | 87 | 81 |
| 2018 | 77 | 77 |
| 2019 | 78 | 54 |
| 2020 | 64 | 79 |
| 2021 | 56 | 117 |
| 2022 | 81 | 91 |
| 2023 | 52 | 74 |
| 2024 | 71 | 67 |
| 2025 | 58 | 52 |
| 2026 | 39 | 31 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Tamper-detect assemblies including heat sink covers with integrated tamper-detect circuitry29 Sep 2026US 12,750,949 B2International Business Machines Corporation
- Electronic device including a substrate with an electronic component and a heat emitting body disposed on respective surfaces of the substrate25 Aug 2026US 12,720,666 B2LG Innotek Co., Ltd.
- Method and system for transfer printing of films25 Aug 2026US 12,720,685 B2University of Virginia Patent Foundation
- Single-layer printed circuit board for a lighting device18 Aug 2026US 12,710,144 B2Lutron Technology Company LLC
- Circuit assembly including gallium nitride devices18 Aug 2026US 12,713,516 B2Murata Manufacturing Co., Ltd.
- Forming a circuit bearing structure with low temperature and pressure during lamination cycle1 Oct 2026US 2026/0304636 A1LCP Medical Technologies, Inc.
- Production method of embedded circuit board10 Sep 2026US 2026/0271193 A1Olympic Circuit Technology Co., Ltd.
- Deformable article20 Aug 2026US 2026/0247526 A1Sendance GmbH
- Resin film, metal-clad laminate, printed wiring board, and method for producing resin film13 Aug 2026US 2026/0233497 A1The University of Osaka
- Method for manufacturing integrated power electronics6 Aug 2026US 2026/0231339 A1Toyota Motor Engineering & Manufacturing North America, Inc.
Most cited
By later US patents
- LED lamp assembly with means to conduct heat away from the LEDS470US 6,045,240 ARelume Corporation · 2000
- Vehicle lamp411US 5,038,255 AFurukawa Electric Co., Ltd. · 1991
- L.E.D. thermal management341US 6,428,189 B1Relume Corporation · 2002
- Thermally protected LED array337US 5,785,418 A1998
- Rearview mirror constructed for efficient assembly308US 6,650,457 B2Gentex Corporation · 2003