H05K 3/0061
Onto a metallic substrate
Official title: {onto a metallic substrate, e.g. a heat sink (heat sinks for electric apparatus H05K7/20)}
H05K3/0061 (Onto a metallic substrate) appears on 1,339 US grants and 1,427 published applications in this corpus.
Search patents in H05K- Granted patents
- 1,339
- Published applications
- 1,427
- Assignees
- 715
- Inventors
- 3,272
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 3 | 0 |
| 1978 | 2 | 0 |
| 1979 | 1 | 0 |
| 1980 | 4 | 0 |
| 1981 | 0 | 0 |
| 1982 | 1 | 0 |
| 1983 | 2 | 0 |
| 1984 | 4 | 0 |
| 1985 | 3 | 0 |
| 1986 | 9 | 0 |
| 1987 | 6 | 0 |
| 1988 | 3 | 0 |
| 1989 | 7 | 0 |
| 1990 | 9 | 0 |
| 1991 | 7 | 0 |
| 1992 | 12 | 0 |
| 1993 | 12 | 0 |
| 1994 | 10 | 0 |
| 1995 | 14 | 0 |
| 1996 | 6 | 0 |
| 1997 | 18 | 0 |
| 1998 | 29 | 0 |
| 1999 | 24 | 0 |
| 2000 | 21 | 0 |
| 2001 | 45 | 9 |
| 2002 | 38 | 19 |
| 2003 | 28 | 38 |
| 2004 | 30 | 46 |
| 2005 | 25 | 51 |
| 2006 | 24 | 77 |
| 2007 | 36 | 81 |
| 2008 | 48 | 89 |
| 2009 | 49 | 85 |
| 2010 | 59 | 102 |
| 2011 | 70 | 79 |
| 2012 | 59 | 59 |
| 2013 | 58 | 74 |
| 2014 | 56 | 68 |
| 2015 | 47 | 53 |
| 2016 | 49 | 48 |
| 2017 | 45 | 39 |
| 2018 | 37 | 43 |
| 2019 | 40 | 34 |
| 2020 | 45 | 48 |
| 2021 | 38 | 73 |
| 2022 | 48 | 63 |
| 2023 | 35 | 54 |
| 2024 | 54 | 40 |
| 2025 | 40 | 41 |
| 2026 | 28 | 14 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Tamper-detect assemblies including heat sink covers with integrated tamper-detect circuitry29 Sep 2026US 12,750,949 B2International Business Machines Corporation
- Electronic device including a substrate with an electronic component and a heat emitting body disposed on respective surfaces of the substrate25 Aug 2026US 12,720,666 B2LG Innotek Co., Ltd.
- Single-layer printed circuit board for a lighting device18 Aug 2026US 12,710,144 B2Lutron Technology Company LLC
- Circuit assembly including gallium nitride devices18 Aug 2026US 12,713,516 B2Murata Manufacturing Co., Ltd.
- Circuit board and manufacturing method18 Aug 2026US 12,713,535 B2NHK Spring Co., Ltd.
- Circuit board23 Jul 2026US 2026/0214785 A1Lite-On Technology Corporation
- Substrate carrier and motor vehicle23 Jul 2026US 2026/0214788 A1Hella GmbH & Co. KGaA
- Power module23 Jul 2026US 2026/0214806 A1Mitsubishi Electric Corporation
- Power semiconductor module23 Jul 2026US 2026/0215273 A1Dynex Semiconductor Limited
- Display Apparatus2 Jul 2026US 2026/0190239 A1LG Display Co., Ltd.
Most cited
By later US patents
- LED lamp assembly with means to conduct heat away from the LEDS470US 6,045,240 ARelume Corporation · 2000
- L.E.D. thermal management341US 6,428,189 B1Relume Corporation · 2002
- Thermally protected LED array337US 5,785,418 A1998
- Attachment assembly for integrated circuits278US 5,856,911 ANational Semiconductor Corporation · 1999
- Mounting arrangement for light emitting diodes214US 6,712,486 B1Permlight Products, Inc. · 2004