Tamper-detect assemblies including heat sink covers with integrated tamper-detect circuitry

A tamper-detect assembly comprising:

• a laminate carrier with embedded tamper-detect circuitry within the laminate carrier;
• one or more electronic components on the laminate carrier;
• and
• a heat sink cover with tamper-detect circuitry integrated within the heat sink cover, the heat sink cover being mounted to the laminate carrier and enclosing the one or more electronic components between the laminate carrier and the heat sink cover, wherein together the embedded tamper-detect circuitry of the laminate carrier and the integrated tamper-detect circuitry of the heat sink cover define, at least in part, a secure volume about the one or more electronic components, and wherein the heat sink cover comprises:
• a heat sink;
• a thermally conductive base;
• and
• wherein the integrated tamper-detect circuitry of the heat sink cover is disposed between and in direct physical contact with and fused to the heat sink and the thermally conductive base of the heat sink cover, wherein the integrated tamper-detect circuitry includes multiple tamper-detect circuit layers stacked in direct physical contact, where adjacent tamper-detect circuit layers in the stack of multiple tamper-detect circuit layers are in direct physical contact and are fused together and one tamper-detect circuit layer of the multiple tamper-detect circuit layers is in direct physical contact with and fused to the heat sink of the heat sink cover and another tamper-detect circuit layer of the multiple tamper-detect circuit layers is in direct physical contact with and fused to the thermally conductive base of the heat sink cover.

A method of fabricating a tamper-detect assembly, the method comprising:

• forming a laminate carrier with embedded tamper-detect circuitry within the laminate carrier;
• providing one or more electronic components on the laminate carrier;
• providing a heat sink cover comprising a heat sink and a tamper-detect circuitry, wherein the tamper-detect circuitry comprises multiple tamper-detect circuit layers stacked in direct physical contact where adjacent tamper-detect circuit layers in the stack of multiple tamper-detect circuit layers are fused together and where one tamper-detect circuit layer of the multiple tamper-detect circuit layers is in direct physical contact with and is fused to the heat sink within the heat sink cover, the adjacent tamper-detect circuit layers being fused together and the one tamper-detect circuit layer and heat sink being fused together to facilitate thermal transfer across the multiple tamper-detect circuit layers to the heat sink;
• and
• mounting the heat sink cover to the laminate carrier to enclose the one or more electronic components between the laminate carrier and the heat sink cover, wherein together the embedded tamper-detect circuitry of the laminate carrier and the tamper-detect circuitry of the heat sink cover define, at least in part, a secure volume about the one or more electronic components.