H05K 3/0067
Onto an inorganic, non-metallic substrate
Official title: {onto an inorganic, non-metallic substrate}
H05K3/0067 (Onto an inorganic, non-metallic substrate) appears on 121 US grants and 97 published applications in this corpus.
Search patents in H05K- Granted patents
- 121
- Published applications
- 97
- Assignees
- 70
- Inventors
- 219
- Latest grant
- 25 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 1 | 0 |
| 1993 | 0 | 0 |
| 1994 | 4 | 0 |
| 1995 | 3 | 0 |
| 1996 | 9 | 0 |
| 1997 | 7 | 0 |
| 1998 | 6 | 0 |
| 1999 | 7 | 0 |
| 2000 | 9 | 0 |
| 2001 | 5 | 1 |
| 2002 | 3 | 2 |
| 2003 | 1 | 4 |
| 2004 | 3 | 2 |
| 2005 | 0 | 5 |
| 2006 | 4 | 1 |
| 2007 | 4 | 2 |
| 2008 | 3 | 2 |
| 2009 | 0 | 2 |
| 2010 | 1 | 4 |
| 2011 | 0 | 2 |
| 2012 | 4 | 3 |
| 2013 | 0 | 5 |
| 2014 | 0 | 1 |
| 2015 | 2 | 3 |
| 2016 | 4 | 7 |
| 2017 | 4 | 6 |
| 2018 | 5 | 3 |
| 2019 | 1 | 4 |
| 2020 | 3 | 4 |
| 2021 | 4 | 6 |
| 2022 | 4 | 7 |
| 2023 | 3 | 4 |
| 2024 | 6 | 7 |
| 2025 | 4 | 5 |
| 2026 | 5 | 5 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Method and system for transfer printing of films25 Aug 2026US 12,720,685 B2University of Virginia Patent Foundation
- Optical module11 Aug 2026US 12,706,429 B2Hisense Broadband Multimedia Technologies Co., Ltd.
- Display device using micro LED and modular display device using same31 Mar 2026US 12,593,551 B2LG Electronics Inc.
- Manufacturing method of circuit board structure24 Feb 2026US 12,563,667 B2Unimicron Technology Corp.
- Electronic device and method of manufacturing electronic device3 Feb 2026US 12,542,341 B2Innolux Corporation
- Glass Barrier Layer Product, and Manufacture Method30 Jul 2026US 2026/0223288 A1AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Multilayer substrate25 Jun 2026US 2026/0181769 A1Fujikura Ltd.
- Reinforcing plate and electrical component11 Jun 2026US 2026/0164540 A1Mektec Corporation
- Folded flexible circuit for automotive laminate7 May 2026US 2026/0124823 A1AGP Worldwide Operations GMBH
- Electronic device and manufacturing method thereof26 Feb 2026US 2026/0059664 A1Innolux Corporation
Most cited
By later US patents
- Method for forming an interconnect having a penetration limited contact structure for establishing a temporary electrical connection with a semiconductor die241US 5,686,317 AMicron Technology, Inc. · 1997
- Carrier for testing an unpackaged semiconductor die215US 5,541,525 AMicron Technology, Inc. · 1996
- Process for manufacturing a semiconductor package with bi-substrate die214US 5,946,553 AMicron Technology, Inc. · 1999
- Testing apparatus having substrate interconnect for discrete die burn-in for nonpackaged die212US 5,408,190 AMicron Technology, Inc. · 1995
- Carrier for testing an unpackaged semiconductor die209US 5,519,332 AMicron Technology, Inc. · 1996