Multilayer substrate
AssigneeFujikura Ltd.
InventorDaisuke Awaji
Life of this patent
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Abstract
A multilayer substrate includes a pair of substrates having opposing surfaces that face each other, and a thermosetting adhesive layer provided between the pair of substrates to bond the pair of substrates to each other. A conductor layer is formed on a formation surface, which is at least one of the opposing surfaces of the pair of substrates. Inclined regions, which are inclined with respect to a surface perpendicular to the formation surface, are formed on side surfaces of the conductor layer. The thermosetting adhesive layer is formed of a thermosetting adhesive material that does not become liquid at a curing temperature.
Claims9
A multilayer substrate comprising:
- a pair of substrates having opposing surfaces that face each other;
- and
- a thermosetting adhesive layer provided between the pair of substrates to bond the pair of substrates to each other,
- wherein a conductor layer is formed on a formation surface, which is at least one of the opposing surfaces of the pair of substrates,
- an inclined region, which is inclined with respect to a surface perpendicular to the formation surface, is formed on at least one side surface of the conductor layer, and
- the thermosetting adhesive layer is formed of a thermosetting adhesive material that does not become liquid at a curing temperature.
Dependencies are inferred from the claim text.