Reinforcing plate and electrical component
AssigneeMektec Corporation
InventorsMasaya SAIGUSA, Hironori AITA, Shuichi KIYOMOTO
Life of this patent
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Abstract
A reinforcing plate to be bonded to a flexible printed circuit board, the reinforcing plate having heat resistance sufficient to withstand a reflow soldering process and configured to include a molded article made of a thermoplastic resin. An electrical component includes the reinforcing plate and the flexible printed circuit board to which the reinforcing plate is bonded.
Claims16
A reinforcing plate to be bonded to a flexible printed circuit board, the reinforcing plate having heat resistance sufficient to withstand a reflow soldering process and configured to include a molded article made of a thermoplastic resin.
Dependencies are inferred from the claim text.