H05K 3/0064
Onto a polymeric substrate
Official title: {onto a polymeric substrate}
H05K3/0064 (Onto a polymeric substrate) appears on 183 US grants and 199 published applications in this corpus.
Search patents in H05K- Granted patents
- 183
- Published applications
- 199
- Assignees
- 182
- Inventors
- 550
- Latest grant
- 25 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 2 | 0 |
| 1981 | 1 | 0 |
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 2 | 0 |
| 1989 | 0 | 0 |
| 1990 | 1 | 0 |
| 1991 | 2 | 0 |
| 1992 | 2 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 5 | 0 |
| 1996 | 2 | 0 |
| 1997 | 1 | 0 |
| 1998 | 3 | 0 |
| 1999 | 0 | 0 |
| 2000 | 5 | 0 |
| 2001 | 6 | 1 |
| 2002 | 3 | 5 |
| 2003 | 3 | 4 |
| 2004 | 5 | 0 |
| 2005 | 2 | 9 |
| 2006 | 1 | 7 |
| 2007 | 4 | 7 |
| 2008 | 7 | 13 |
| 2009 | 4 | 14 |
| 2010 | 8 | 10 |
| 2011 | 10 | 9 |
| 2012 | 5 | 5 |
| 2013 | 4 | 8 |
| 2014 | 8 | 6 |
| 2015 | 4 | 7 |
| 2016 | 6 | 16 |
| 2017 | 11 | 7 |
| 2018 | 10 | 11 |
| 2019 | 11 | 4 |
| 2020 | 4 | 8 |
| 2021 | 5 | 16 |
| 2022 | 11 | 11 |
| 2023 | 5 | 7 |
| 2024 | 7 | 5 |
| 2025 | 8 | 3 |
| 2026 | 1 | 6 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Method and system for transfer printing of films25 Aug 2026US 12,720,685 B2University of Virginia Patent Foundation
- Battery connection module25 Nov 2025US 12,482,903 B2Molex Incorporated
- Manufacturing method of electronic device and electronic device4 Nov 2025US 12,464,652 B2Innolux Corporation
- Method for manufacturing a detector30 Sep 2025US 12,429,414 B2Kidde Fire Protection, LLC
- Substrate structures and methods of manufacture9 Sep 2025US 12,414,238 B2Semiconductor Components Industries, LLC
- Forming a circuit bearing structure with low temperature and pressure during lamination cycle1 Oct 2026US 2026/0304636 A1LCP Medical Technologies, Inc.
- Deformable article20 Aug 2026US 2026/0247526 A1Sendance GmbH
- Resin film, metal-clad laminate, printed wiring board, and method for producing resin film13 Aug 2026US 2026/0233497 A1The University of Osaka
- Method for manufacturing integrated power electronics6 Aug 2026US 2026/0231339 A1Toyota Motor Engineering & Manufacturing North America, Inc.
- Reinforcing plate and electrical component11 Jun 2026US 2026/0164540 A1Mektec Corporation
Most cited
By later US patents
- Vehicle lamp411US 5,038,255 AFurukawa Electric Co., Ltd. · 1991
- Hybrid integrated circuit component and printed circuit board mounting said component90US 4,495,546 AMatsushita Electric Industrial Co., Ltd. · 1985
- Flexible printed circuit and electrical connection therefor73US 4,116,517 AInternational Telephone and Telegraph Corporation · 1978
- Printed circuit boards70US 4,751,146 AShowa Denko K. K. · 1988
- Rigid circuit board for liquid crystal display including cut out for providing flexibility to said board68US 6,104,464 AMitsubishi Denki Kabushiki Kaisha · 2000