Printed circuit boards

Abstract

A heat resistant printed circuit board is disclosed which comprises a laminate of: (A) a thin-walled body having a thickness of from 0.2 .mu.m to less than 5 mm and containing a cross-linked product of a mixture of (a) 1 to 99 wt. % of an ethylenic copolymer (A) comprised of 30 to 99.5 wt. % of ethylene, and an oxirane ring-containing compound having at least one double bond and having 6 to 30 carbon atoms, and (b) 99 to 1 wt. % of an ethylenic copolymer (B) comprised of 30 to 99.5 wt. % of ethylene, and a comonomer selected from the group consisting of unsaturated monocarboxylic acids, unsaturated dicarboxylic acids, unsaturated dicarboxylic acid anhydrides, and half esters of unsaturated dicarboxylic acids; and (B) an electrically conductive metal layer having a thickness of from 100 .ANG. to 400 .mu.m. The boards have excellent heat resistance, electrical insulating properties, flexibility, chemical resistance, dimensional stability, etc.

Dependencies are inferred from the claim text.