H05K 3/02
In which the conductive material is applied to the surface of the
Official title: in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
H05K3/02 (In which the conductive material is applied to the surface of the) appears on 4,805 US grants and 4,424 published applications in this corpus.
Search patents in H05K- Granted patents
- 4,805
- Published applications
- 4,424
- Assignees
- 1,679
- Inventors
- 9,887
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 38 | 0 |
| 1977 | 25 | 0 |
| 1978 | 29 | 0 |
| 1979 | 17 | 0 |
| 1980 | 33 | 0 |
| 1981 | 30 | 0 |
| 1982 | 40 | 0 |
| 1983 | 51 | 0 |
| 1984 | 51 | 0 |
| 1985 | 55 | 0 |
| 1986 | 41 | 0 |
| 1987 | 62 | 0 |
| 1988 | 65 | 0 |
| 1989 | 70 | 0 |
| 1990 | 83 | 0 |
| 1991 | 86 | 0 |
| 1992 | 82 | 0 |
| 1993 | 69 | 0 |
| 1994 | 72 | 0 |
| 1995 | 67 | 0 |
| 1996 | 65 | 0 |
| 1997 | 63 | 0 |
| 1998 | 100 | 0 |
| 1999 | 88 | 0 |
| 2000 | 99 | 0 |
| 2001 | 118 | 64 |
| 2002 | 125 | 155 |
| 2003 | 144 | 162 |
| 2004 | 141 | 181 |
| 2005 | 103 | 178 |
| 2006 | 108 | 172 |
| 2007 | 102 | 197 |
| 2008 | 85 | 188 |
| 2009 | 81 | 225 |
| 2010 | 124 | 169 |
| 2011 | 109 | 157 |
| 2012 | 126 | 137 |
| 2013 | 123 | 151 |
| 2014 | 99 | 190 |
| 2015 | 126 | 243 |
| 2016 | 161 | 195 |
| 2017 | 158 | 203 |
| 2018 | 171 | 203 |
| 2019 | 195 | 173 |
| 2020 | 194 | 195 |
| 2021 | 147 | 190 |
| 2022 | 152 | 181 |
| 2023 | 133 | 173 |
| 2024 | 124 | 136 |
| 2025 | 117 | 128 |
| 2026 | 58 | 78 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
- H05K 3/06The conductive material being removed chemically or electrolytically2,554
- H05K 3/022Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates1,016
- H05K 3/04The conductive material being removed mechanically820
- H05K 3/027The conductive material being removed by irradiation422
- H05K 3/08The conductive material being removed by electric discharge27
Recent patents
- Tape processing method6 Oct 2026US 12,757,333 B2Chipbond Technology Corporation
- Method for integrating a copper-graphene laminate (CGL) in a multilayer PCB fabrication process6 Oct 2026US 12,757,335 B2Bar-Ilan University
- Method for manufacturing circuit board29 Sep 2026US 12,750,948 B2Mitsui Kinzoku Company, Limited
- Wiring circuit board having a conductive layer with a via portion15 Sep 2026US 12,739,981 B2Nitto Denko Corporation
- Methods of forming interconnect circuits methods15 Sep 2026US 12,739,982 B2CelLink Corporation
- Adhesive film, adhesive film with metal layer, wiring formation member, formation method for wiring layer, and wired member1 Oct 2026US 2026/0297391 A1Resonac Corporation
- Photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for producing printed wiring board1 Oct 2026US 2026/0299414 A1Resonac Corporation
- Photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for manufacturing wiring substrate1 Oct 2026US 2026/0299416 A1Resonac Corporation
- Material selection assistance device, circuit board manufacturing method, circuit board core, and circuit board1 Oct 2026US 2026/0304614 A1
- Printed circuit board and manufacturing method thereof1 Oct 2026US 2026/0304620 A1LG Electronics Inc.
Most cited
By later US patents
- Formation of microstamped patterns on surfaces and derivative articles1,049US 5,512,131 APresident and Fellows of Harvard College · 1996
- Method of forming articles including waveguides via capillary micromolding and microtransfer molding512US 6,355,198 B1President and Fellows of Harvard College · 2002
- Step and flash imprint lithography459US 6,334,960 B12002
- Electroless CU deposition on a barrier layer by CU contact displacement for ULSI applications448US 5,891,513 ACornell Research Foundation, Inc. · 1999
- Method for producing coplanar multi-level metal/insulator films on a substrate and for forming patterned conductive lines simultaneously with stud vias406US 4,789,648 AInternational Business Machines Corporation · 1988