H05K 3/08
The conductive material being removed by electric discharge
Official title: the conductive material being removed by electric discharge, e.g. by spark erosion
H05K3/08 (The conductive material being removed by electric discharge) appears on 27 US grants and 14 published applications in this corpus.
Search patents in H05K- Granted patents
- 27
- Published applications
- 14
- Assignees
- 23
- Inventors
- 68
- Latest grant
- 18 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 1 | 0 |
| 1986 | 2 | 0 |
| 1987 | 2 | 0 |
| 1988 | 3 | 0 |
| 1989 | 1 | 0 |
| 1990 | 1 | 0 |
| 1991 | 2 | 0 |
| 1992 | 3 | 0 |
| 1993 | 1 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 1 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 0 |
| 2004 | 0 | 0 |
| 2005 | 0 | 0 |
| 2006 | 0 | 1 |
| 2007 | 0 | 0 |
| 2008 | 0 | 0 |
| 2009 | 0 | 0 |
| 2010 | 0 | 0 |
| 2011 | 0 | 0 |
| 2012 | 0 | 1 |
| 2013 | 0 | 0 |
| 2014 | 0 | 0 |
| 2015 | 0 | 2 |
| 2016 | 1 | 0 |
| 2017 | 0 | 0 |
| 2018 | 0 | 0 |
| 2019 | 1 | 1 |
| 2020 | 0 | 2 |
| 2021 | 1 | 0 |
| 2022 | 1 | 2 |
| 2023 | 1 | 2 |
| 2024 | 1 | 1 |
| 2025 | 1 | 0 |
| 2026 | 1 | 2 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
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- Method for forming pattern on substrate structure without using mask layer and substrate structure22 Jun 2023US 2023/0199968 A1Amulaire Thermal Technology, Inc.
- Etching method for manufacturing substrate structure having thick electrically conductive layer, and substrate structure having thick electrically conductive layer22 Jun 2023US 2023/0199969 A1Amulaire Thermal Technology, Inc.
Most cited
By later US patents
- Plasma etching device and process35US 5,099,100 ABranson International Plasma Corporation · 1992
- Circuit boards with recessed traces32US 4,985,601 A1991
- Elimination of island formation and contact resistance problems during electroetching of blanket or patterned thin metallic layers on insulating substrate32US 5,567,304 AIBM Corporation · 1996
- Method of dry copper etching and its implementation29US 4,557,796 AInternational Business Machines Corporation · 1985
- Circuit boards with recessed traces21US 5,055,637 A1991