Laser cutting of metal-ceramic substrates
AssigneeHeraeus Deutschland GmbH & Co. KG
InventorsAlexander Rogg, Bogdan Lisca
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Abstract
The present application relates to a method of laser ablation of a metal-ceramic substrate, in which a laser is used under process conditions in which the formation of solid metal particles on the metal-ceramic substrate, which can separate from metal particles released by laser ablation near the ablation edge, is essentially avoided. Further the present application relates to a ceramic-metal substrate comprising a ceramic substrate and a metallization on at least one side of the ceramic substrate, wherein the ceramic substrate and the metallization have flush cutting edge.
Claims8
A method for ablation of a metal-ceramic substrate, comprising:
- ablating the metal-ceramic substrate with a laser;
- wherein the laser is used under process conditions such that less than 50% of the surface area near the ablation edge of the metal-ceramic substrate is covered with metal particles, wherein the area near the ablation edge has a width, calculated from the edge of the recess, of at most 200 μm;
- wherein the laser is used with a relationship between the laser power (W) and the effective maximal processing speed of the laser (m/sec) which corresponds to the following formula (1):
- y≤4.7 ln x−15 (1)
- wherein
- x=laser power in W;
- y=effective maximal laser processing speed in m/sec;
- and
- wherein the laser power x is between 40 W and 200 W.
Dependencies are inferred from the claim text.