Tape processing method
AssigneeChipbond Technology Corporation
InventorsYi-Hui Chen, Yi-Hua Huang, Yen-Ping Huang, Shih-Chieh Chang
Life of this patent
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Abstract
In a tape processing method, a tape including substrate units is processed by a die device. Each of the substrate units includes a carrier, a circuit layer, an adhesive and a heat spreader which is attached onto the carrier by the adhesive. The die device is provided to press the tape to generate separation protrusions on the heat spreader and allow the separation protrusions to protrude from a heat dissipation surface of the heat spreader. When rolling the tape, the separation protrusions can separate the stacked substrate units to prevent the adhesive from being squeezed out to contaminate the tape.
Claims5
A tape processing method operatively associated with a die device including a punch-cutting element and a plurality of punch-pressing elements located outside the punch-cutting element, the tape processing method comprising steps of:
- providing a tape including a plurality of substrate units, each of the plurality of substrate units includes a carrier, a circuit layer located on the carrier, an adhesive, and a heat spreader adhered on the carrier by the adhesive, wherein the carrier includes a first to-be-removed portion, the adhesive includes a second to-be-removed portion corresponding to the first to-be-removed portion, and the heat spreader includes a third to-be-removed portion corresponding to the first to-be-removed portion;
- cutting one of the plurality of substrate units using the punch-cutting element when the substrate unit is defective, wherein the first to-be-removed portion is cut and separated from the carrier, the second to-be-removed portion is cut and separated from the adhesive, and the third to-be-removed portion is cut and separated from the heat spreader;
- and
- pressing one of the plurality of substrate units using the plurality of punch-pressing elements to generate a plurality of separation protrusions on the heat spreader when the substrate unit is not defective, wherein the plurality of separation protrusions protrude from a heat dissipation surface of the heat spreader.
Dependencies are inferred from the claim text.