H05K 3/022
Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
Official title: {Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates}
H05K3/022 (Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates) appears on 1,016 US grants and 1,072 published applications in this corpus.
Search patents in H05K- Granted patents
- 1,016
- Published applications
- 1,072
- Assignees
- 503
- Inventors
- 2,482
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 8 | 0 |
| 1977 | 7 | 0 |
| 1978 | 6 | 0 |
| 1979 | 2 | 0 |
| 1980 | 3 | 0 |
| 1981 | 4 | 0 |
| 1982 | 7 | 0 |
| 1983 | 17 | 0 |
| 1984 | 11 | 0 |
| 1985 | 11 | 0 |
| 1986 | 9 | 0 |
| 1987 | 12 | 0 |
| 1988 | 12 | 0 |
| 1989 | 13 | 0 |
| 1990 | 14 | 0 |
| 1991 | 16 | 0 |
| 1992 | 18 | 0 |
| 1993 | 7 | 0 |
| 1994 | 12 | 0 |
| 1995 | 14 | 0 |
| 1996 | 10 | 0 |
| 1997 | 15 | 0 |
| 1998 | 27 | 0 |
| 1999 | 28 | 0 |
| 2000 | 27 | 0 |
| 2001 | 28 | 11 |
| 2002 | 19 | 36 |
| 2003 | 27 | 23 |
| 2004 | 23 | 26 |
| 2005 | 14 | 29 |
| 2006 | 19 | 28 |
| 2007 | 14 | 29 |
| 2008 | 8 | 18 |
| 2009 | 7 | 34 |
| 2010 | 18 | 38 |
| 2011 | 11 | 27 |
| 2012 | 24 | 32 |
| 2013 | 18 | 36 |
| 2014 | 19 | 54 |
| 2015 | 20 | 67 |
| 2016 | 27 | 46 |
| 2017 | 39 | 50 |
| 2018 | 40 | 59 |
| 2019 | 42 | 41 |
| 2020 | 52 | 59 |
| 2021 | 35 | 74 |
| 2022 | 48 | 65 |
| 2023 | 46 | 61 |
| 2024 | 45 | 58 |
| 2025 | 41 | 45 |
| 2026 | 22 | 26 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Method for manufacturing circuit board29 Sep 2026US 12,750,948 B2Mitsui Kinzoku Company, Limited
- Circuit board assembly and method of manufacturing the same, packaging structure having the same1 Sep 2026US 12,727,091 B2Avary Holding (Shenzhen) Co., Limited.
- Systems and methods for fabricating a 2D-material-based quantum sensor chip14 Jul 2026US 12,685,199 B2Toyota Jidosha Kabushiki Kaisha
- Methods for promoting selective copper foil adhesion in a printed circuit board7 Jul 2026US 12,677,377 B2Rockwell Collins, Inc.
- Low-transmission-loss copper-based composite material and preparation method thereof, PCB, and electronic component30 Jun 2026US 12,668,890 B2Songshan Lake Materials Laboratory
- Manufacturing method for long circuit board and long circuit board1 Oct 2026US 2026/0304643 A1
- Method of manufacturing multilayer pcb for semiconductor testing and multilayer pcb manufactured thereby27 Aug 2026US 2026/0255494 A1Tes Co., Ltd
- Resin film, metal-clad laminate, printed wiring board, and method for producing resin film13 Aug 2026US 2026/0233497 A1The University of Osaka
- A Manufacturing Method of Near-Field Wireless Communication Antennas by Using Textile Materials13 Aug 2026US 2026/0239540 A1Digital Clothing Limited
- Temporary carrier plate and manufacturing method thereof, and manufacturing method for packaging substrate23 Jul 2026US 2026/0214810 A1Nantong Access Semiconductor Co., Ltd.
Most cited
By later US patents
- Multilayer circuit board manufacturing278US 4,642,160 AInterconnect Technology Inc. · 1987
- Process for forming polyimide-metal laminates253US 5,478,462 APolyonics Corporation · 1995
- Manufacturing circuit board assemblies having filled vias171US 5,822,856 AInternational Business Machines Corporation · 1998
- Method of producing boards for printed wiring159US 5,449,480 AHitachi Chemical Company, Ltd. · 1995
- Electronic chip package114US 6,544,638 B2Gore Enterprise Holdings, Inc. · 2003