H05K 3/025
By transfer of thin metal foil formed on a temporary carrier
Official title: {by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper}
H05K3/025 (By transfer of thin metal foil formed on a temporary carrier) appears on 354 US grants and 327 published applications in this corpus.
Search patents in H05K- Granted patents
- 354
- Published applications
- 327
- Assignees
- 196
- Inventors
- 706
- Latest grant
- 14 Jul 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 5 | 0 |
| 1977 | 2 | 0 |
| 1978 | 2 | 0 |
| 1979 | 2 | 0 |
| 1980 | 1 | 0 |
| 1981 | 2 | 0 |
| 1982 | 3 | 0 |
| 1983 | 7 | 0 |
| 1984 | 6 | 0 |
| 1985 | 2 | 0 |
| 1986 | 3 | 0 |
| 1987 | 4 | 0 |
| 1988 | 2 | 0 |
| 1989 | 1 | 0 |
| 1990 | 3 | 0 |
| 1991 | 5 | 0 |
| 1992 | 5 | 0 |
| 1993 | 1 | 0 |
| 1994 | 2 | 0 |
| 1995 | 6 | 0 |
| 1996 | 2 | 0 |
| 1997 | 5 | 0 |
| 1998 | 4 | 0 |
| 1999 | 13 | 0 |
| 2000 | 14 | 0 |
| 2001 | 16 | 6 |
| 2002 | 11 | 21 |
| 2003 | 17 | 12 |
| 2004 | 14 | 16 |
| 2005 | 9 | 14 |
| 2006 | 10 | 13 |
| 2007 | 11 | 15 |
| 2008 | 4 | 6 |
| 2009 | 5 | 20 |
| 2010 | 12 | 24 |
| 2011 | 7 | 15 |
| 2012 | 14 | 11 |
| 2013 | 11 | 5 |
| 2014 | 6 | 5 |
| 2015 | 6 | 15 |
| 2016 | 2 | 19 |
| 2017 | 12 | 19 |
| 2018 | 15 | 17 |
| 2019 | 20 | 9 |
| 2020 | 9 | 9 |
| 2021 | 8 | 17 |
| 2022 | 9 | 7 |
| 2023 | 9 | 4 |
| 2024 | 5 | 15 |
| 2025 | 4 | 7 |
| 2026 | 6 | 6 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Systems and methods for fabricating a 2D-material-based quantum sensor chip14 Jul 2026US 12,685,199 B2Toyota Jidosha Kabushiki Kaisha
- Temporary carrier plate and manufacturing method thereof, and manufacturing method for packaging substrate14 Apr 2026US 12,604,414 B2Nantong Access Semiconductor Co., Ltd.
- Ultra-thin copper foil with carrier foil for allowing easy micro-hole processing, copper-clad laminate using same, and manufacturing method therefor7 Apr 2026US 12,598,699 B2Lotte Energy Materials Corporation
- Micro-roughened electrodeposited copper foil and copper clad laminate17 Feb 2026US 12,557,213 B2Co-Tech Development Corp.
- Copper clad laminate and printed wiring board27 Jan 2026US 12,538,420 B2Sony Group Corporation
- Temporary carrier plate and manufacturing method thereof, and manufacturing method for packaging substrate23 Jul 2026US 2026/0214810 A1Nantong Access Semiconductor Co., Ltd.
- Copper foil attached to carrier foil and copper clad laminate using same9 Jul 2026US 2026/0192551 A1Lotte Energy Materials Corporation
- Composite copper foil and manufacturing method thereof7 May 2026US 2026/0124821 A1Nan Ya Plastics Corporation
- Copper-clad laminate having low dielectric constant, low dielectric loss and high thermal conductivity and method for manufacturing the same23 Apr 2026US 2026/0113853 A1CRHM Co., Ltd.
- Circuit19 Mar 2026US 2026/0082486 A1Chibitronics Inc.
Most cited
By later US patents
- Multilayer circuit board manufacturing278US 4,642,160 AInterconnect Technology Inc. · 1987
- Manufacturing circuit board assemblies having filled vias171US 5,822,856 AInternational Business Machines Corporation · 1998
- Method of producing boards for printed wiring159US 5,449,480 AHitachi Chemical Company, Ltd. · 1995
- Methods for fabricating flexible circuit structures99US 6,391,220 B1Fujitsu Limited · 2002
- Method of fabricating printed circuit board having embedded multi-layer passive devices86US 7,293,356 B2Samsung Electro-Mechanics Co., Ltd. · 2007