Ultra-thin copper foil with carrier foil for allowing easy micro-hole processing, copper-clad laminate using same, and manufacturing method therefor
AssigneeLotte Energy Materials Corporation
InventorsChang Yol Yang, Won Jin Beom, Kideok Song, Hyung Cheol Kim
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Abstract
Disclosed is an ultra thin copper foil with a carrier foil and a manufacturing method therefor, wherein the ultra-thin copper foil with a carrier foil includes a carrier foil, a peeling layer, and an ultra-thin copper foil sequentially laminated, and the carrier foil includes a surface treatment layer on a face thereof facing the peeling layer.
Claims8
A method for manufacturing an ultra-thin copper foil with a carrier foil by comprising forming a lamination structure of a carrier foil, a peeling layer, and an ultra-thin copper foil,
- wherein the forming of the lamination structure comprises:
- providing the carrier foil;
- etching one surface of the carrier foil to form a surface treatment layer;
- and
- sequentially forming the peeling layer and the ultra-thin copper foil on the surface treatment layer,
- wherein the surface treatment layer has a surface structure in which protrusions with an average width of 10 μm or less are arranged.
A method for manufacturing an ultra-thin copper foil comprising:
- forming a lamination structure of a carrier foil, a peeling layer, and an ultra-thin copper foil;
- and
- peeling the ultra-thin copper foil from the lamination structure,
- wherein the forming of the lamination structure comprises:
- providing the carrier foil;
- etching one surface of the carrier foil to form a surface treatment layer;
- and
- sequentially forming the peeling layer and the ultra-thin copper foil on the surface treatment layer,
- wherein a surface structure of the peeled ultra-thin copper foil has grooves with an average width of 10 μm or less.
Dependencies are inferred from the claim text.