Copper clad laminate and printed wiring board

Abstract

An object of the present technology is to provide a copper clad laminate including a resin substrate that has biodegradability and less likely to warp or crack. The present technology provides a copper clad laminate including: a resin substrate; an adhesive layer; and a copper foil layer, the adhesive layer and the copper foil layer being stacked in this order on at least one side of the resin substrate, the resin substrate containing at least 50 mass % or more of polylactic acid, the degree of crystallization of the polylactic acid calculated on a basis of a result of differential scanning calorimetry being 29% or more and 36% or less, a crystallite size of the polylactic acid calculated on a basis of a result of X-ray diffraction measurement being 19 nm or more and 26 nm or less. Further, the present technology provides a printed wiring board formed using the copper clad laminate.

Dependencies are inferred from the claim text.