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US 6,544,638 B2Granted
Electronic chip package
AssigneeGore Enterprise Holdings, Inc.
InventorsPaul J. Fischer, Joseph E. Korleski
Life of this patent
Estimating the term…
Abstract
An electronic chip package is provided having a laminated substrate. The laminated substrate includes at least one conductive layer and at least one dielectric layer which is bonded to the conductive layer. The dielectric layer has a glass transition temperature Tg greater than 200° C. and a volumetric coefficient of thermal expansion of ≦75 ppm/° C. A semiconductor device is electrically attached to the laminated substrate.
Claims12
A chip package comprising:
- a laminated substrate having at least one conductive layer;
- and at least one dielectric layer bonded to the conductive layer, the dielectric layer having a glass transition temperature Tg greater than 200° C. and a volumetric coefficient of thermal expansion of ≦75 ppm/° C.;
- and the dielectric layer is a thermoset adhesive having an inorganic filler material disposed therein;
- and
- a semiconductor device electrically attached to the laminated substrate.
2 more elements
A chip package comprising:
- a laminated substrate having at least one conductive layer and at least one dielectric layer bonded to the conductive layer, wherein the dielectric layer includes a thermoset adhesive having an inorganic filler, and wherein the dielectric layer has a glass transition temperature (Tg) greater than 200° C. and a volumetric coefficient of thermal expansion of ≦75 ppm/° C.;
- and
- a semiconductor device electrically attached to the laminated substrate.
A chip package comprising:
- a laminated substrate having at least one conductive layer and at least one dielectric layer bonded to the conductive layer, wherein the dielectric layer includes a thermoset adhesive, an organic resin and an inorganic filler which is a particulate, and wherein the dielectric layer has a glass transition temperature (Tg) greater than 200° C.;
- and
- a semiconductor device electrically attached to the laminated substrate.
Dependencies are inferred from the claim text.