Method for manufacturing circuit board

Abstract

A method for manufacturing a circuit board that achieves both high adhesion and excellent high-frequency characteristics is provided. The circuit board includes a high-frequency circuit including a substrate, a ground layer, and a signal layer, and at least the signal layer is a layer derived from a copper foil. The method includes: (a) designing a specification of a high-frequency circuit having a predetermined impedance Z1 based on an assumption that the high-frequency circuit is manufactured using a copper foil without an adhesive layer; and (b) forming a high-frequency circuit in accordance with the specification, except for using, instead of the copper foil without an adhesive layer, an adhesive-layer-attached copper foil to form the signal layer so that an adhesive layer is interposed between the substrate and the signal layer, thereby manufacturing a circuit board in which the high-frequency circuit has an impedance Z2 that is greater than Z1.

Dependencies are inferred from the claim text.