H05K 3/06
The conductive material being removed chemically or electrolytically
Official title: the conductive material being removed chemically or electrolytically, e.g. by photo-etch process {(semi-additive methods H05K3/108)}
H05K3/06 (The conductive material being removed chemically or electrolytically) appears on 2,554 US grants and 2,271 published applications in this corpus.
Search patents in H05K- Granted patents
- 2,554
- Published applications
- 2,271
- Assignees
- 959
- Inventors
- 5,285
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 24 | 0 |
| 1977 | 13 | 0 |
| 1978 | 15 | 0 |
| 1979 | 12 | 0 |
| 1980 | 21 | 0 |
| 1981 | 21 | 0 |
| 1982 | 22 | 0 |
| 1983 | 23 | 0 |
| 1984 | 26 | 0 |
| 1985 | 30 | 0 |
| 1986 | 24 | 0 |
| 1987 | 32 | 0 |
| 1988 | 39 | 0 |
| 1989 | 32 | 0 |
| 1990 | 49 | 0 |
| 1991 | 53 | 0 |
| 1992 | 45 | 0 |
| 1993 | 47 | 0 |
| 1994 | 41 | 0 |
| 1995 | 42 | 0 |
| 1996 | 37 | 0 |
| 1997 | 32 | 0 |
| 1998 | 47 | 0 |
| 1999 | 37 | 0 |
| 2000 | 44 | 0 |
| 2001 | 58 | 33 |
| 2002 | 72 | 68 |
| 2003 | 74 | 86 |
| 2004 | 66 | 96 |
| 2005 | 55 | 91 |
| 2006 | 54 | 87 |
| 2007 | 59 | 105 |
| 2008 | 43 | 106 |
| 2009 | 54 | 131 |
| 2010 | 57 | 80 |
| 2011 | 65 | 91 |
| 2012 | 70 | 69 |
| 2013 | 73 | 75 |
| 2014 | 50 | 91 |
| 2015 | 72 | 119 |
| 2016 | 94 | 109 |
| 2017 | 86 | 119 |
| 2018 | 100 | 113 |
| 2019 | 106 | 101 |
| 2020 | 109 | 89 |
| 2021 | 63 | 78 |
| 2022 | 72 | 87 |
| 2023 | 54 | 79 |
| 2024 | 58 | 63 |
| 2025 | 54 | 68 |
| 2026 | 28 | 37 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Method for integrating a copper-graphene laminate (CGL) in a multilayer PCB fabrication process6 Oct 2026US 12,757,335 B2Bar-Ilan University
- Wiring circuit board having a conductive layer with a via portion15 Sep 2026US 12,739,981 B2Nitto Denko Corporation
- Methods of forming interconnect circuits methods15 Sep 2026US 12,739,982 B2CelLink Corporation
- Enhanced subtractive etch anisotropy using etch rate gradient8 Sep 2026US 12,733,107 B2Intel Corporation
- Electronic device and manufacturing method thereof8 Sep 2026US 12,733,523 B2Innolux Corporation
- Adhesive film, adhesive film with metal layer, wiring formation member, formation method for wiring layer, and wired member1 Oct 2026US 2026/0297391 A1Resonac Corporation
- Photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for producing printed wiring board1 Oct 2026US 2026/0299414 A1Resonac Corporation
- Photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for manufacturing wiring substrate1 Oct 2026US 2026/0299416 A1Resonac Corporation
- Material selection assistance device, circuit board manufacturing method, circuit board core, and circuit board1 Oct 2026US 2026/0304614 A1
- Forming a circuit bearing structure with low temperature and pressure during lamination cycle1 Oct 2026US 2026/0304636 A1LCP Medical Technologies, Inc.
Most cited
By later US patents
- Formation of microstamped patterns on surfaces and derivative articles1,049US 5,512,131 APresident and Fellows of Harvard College · 1996
- Method of forming articles including waveguides via capillary micromolding and microtransfer molding512US 6,355,198 B1President and Fellows of Harvard College · 2002
- Step and flash imprint lithography459US 6,334,960 B12002
- Flexible circuits for electrosurgical instrument378US 10,555,769 B2Ethicon, Inc. · 2020
- High-density, multi-level interconnects, flex circuits, and tape for tab285US 5,106,461 AMassachusetts Institute of Technology · 1992