H05K 3/07
Being removed electrolytically
Official title: being removed electrolytically
H05K3/07 (Being removed electrolytically) appears on 75 US grants and 58 published applications in this corpus.
Search patents in H05K- Granted patents
- 75
- Published applications
- 58
- Assignees
- 63
- Inventors
- 180
- Latest grant
- 2 May 2023
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 3 | 0 |
| 1977 | 0 | 0 |
| 1978 | 1 | 0 |
| 1979 | 1 | 0 |
| 1980 | 2 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 1 | 0 |
| 1984 | 3 | 0 |
| 1985 | 2 | 0 |
| 1986 | 0 | 0 |
| 1987 | 1 | 0 |
| 1988 | 2 | 0 |
| 1989 | 1 | 0 |
| 1990 | 4 | 0 |
| 1991 | 1 | 0 |
| 1992 | 9 | 0 |
| 1993 | 1 | 0 |
| 1994 | 3 | 0 |
| 1995 | 2 | 0 |
| 1996 | 2 | 0 |
| 1997 | 1 | 0 |
| 1998 | 3 | 0 |
| 1999 | 1 | 0 |
| 2000 | 3 | 0 |
| 2001 | 4 | 1 |
| 2002 | 2 | 1 |
| 2003 | 0 | 1 |
| 2004 | 1 | 7 |
| 2005 | 1 | 3 |
| 2006 | 2 | 2 |
| 2007 | 0 | 2 |
| 2008 | 0 | 2 |
| 2009 | 1 | 14 |
| 2010 | 2 | 2 |
| 2011 | 2 | 1 |
| 2012 | 2 | 4 |
| 2013 | 3 | 0 |
| 2014 | 1 | 3 |
| 2015 | 0 | 3 |
| 2016 | 2 | 2 |
| 2017 | 0 | 1 |
| 2018 | 2 | 1 |
| 2019 | 1 | 1 |
| 2020 | 0 | 0 |
| 2021 | 0 | 1 |
| 2022 | 1 | 0 |
| 2023 | 1 | 0 |
| 2024 | 0 | 1 |
| 2025 | 0 | 5 |
By publication year. Applications have been published since 2001.
Recent patents
- Method for manufacturing printed circuit board2 May 2023US 11,641,716 B2Sumitomo Electric Printed Circuits, Inc.
- Electronic circuit production1 Mar 2022US 11,266,023 B2DST Innovations Limited
- Low cost substrates7 May 2019US 10,283,484 B2Invensas Corporation
- Method for manufacturing an electrical circuit board, electrical circuit board obtained by this method and smart card comprising such an electrical circuit board16 Oct 2018US 10,102,470 B2Linxens Holding
- Chemical mechanical planarization apparatus and methods24 Apr 2018US 9,950,405 B2Semiconductor Manufacturing International (Beijing) Corporation
- Method for manufacturing printed wiring board2 Oct 2025US 2025/0311115 A1Ibiden Co., Ltd.
- Wiring substrate and manufacturing method of wiring substrate14 Aug 2025US 2025/0261302 A1Toppan Holdings Inc.
- Printed wiring board17 Apr 2025US 2025/0126709 A1Ibiden Co., Ltd.
- Ceramic substrate unit and manufacturing method thereof27 Feb 2025US 2025/0071893 A1Amosense Co., Ltd.
- Method for manufacturing circuit board20 Feb 2025US 2025/0063671 A1Lx Semicon Co., Ltd.
Most cited
By later US patents
- Method for manufacturing printed circuit boards96US 4,943,346 ASiemens Aktiengesellschaft · 1990
- Thin-film assembly and method for producing said assembly68US 7,551,454 B2AT&S Austria Technologie & Systemtechnik Aktiengesellschaft · 2009
- Circuitization of polymeric circuit boards with galvanic removal of chromium adhesion layers62US 5,126,016 AInternational Business Machines Corporation · 1992
- Plating method and apparatus52US 4,401,522 AMicro-Plate, Inc. · 1983
- Method and apparatus for manufacturing interconnects with fine lines and spacing49US 5,024,735 A1991