Method for manufacturing printed circuit board
AssigneeSumitomo Electric Printed Circuits, Inc.
InventorsKou Noguchi, Hiroshi Ueda
Life of this patent
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Abstract
A method for manufacturing a printed circuit board according to one embodiment of the present invention includes a step of forming a resist pattern, and a step of forming a conductive pattern by using the resist pattern. The resist pattern has an acute angle portion in which an outer edge of a resist is bent to form an acute angle in a plan view. In a corner portion of the acute angle portion, an outer-side outer edge of the resist is rounded, and a radius of curvature of the outer-side outer edge is more than or equal to a distance from the outer-side outer edge to another outer edge adjacent thereto in a direction away from a center of curvature of the outer-side outer edge.
Claims6
A method for manufacturing a printed circuit board, comprising a step of forming a resist pattern from a resist, and a step of forming a conductive pattern by performing selective plating or etching by using the resist pattern,
- wherein the resist pattern has an acute angle portion in which an outer edge of the resist is bent to form an acute angle in a plan view,
- in a corner portion of the acute angle portion, an outer-side outer edge of the resist is rounded, and a radius of curvature of the outer-side outer edge is more than or equal to a distance from the outer-side outer edge to another outer edge adjacent thereto in a direction away from a center of curvature of the outer-side outer edge, and
- an average thickness of the resist is 15 μm or more and 100 μm or less.
A method for manufacturing a printed circuit board, comprising a step of forming a resist pattern from a resist, and a step of forming a conductive pattern by performing selective plating or etching by using the resist pattern,
- wherein the resist pattern has three or more linear openings and an annular opening,
- the three or more linear openings are connected via the annular opening, and
- an average thickness of the resist is 15 μm or more and 100 μm or less.
Dependencies are inferred from the claim text.