Ceramic substrate unit and manufacturing method thereof

Abstract

The present invention relates to a ceramic substrate unit comprising: a ceramic substrate including a ceramic basic material and a circuit pattern formed on the ceramic basic material; an electrode pattern portion included in the circuit pattern on the ceramic substrate and connected to an electrode of a semiconductor chip mounted on the ceramic substrate; and a spacer bonded to the electrode pattern portion of the ceramic substrate by means of a bonding layer, wherein the spacer is made of a metal or alloy having electrical conductivity and thermal conductivity. According to the present invention, a power semiconductor chip can be mounted on a substrate in a form similar to flip-chip bonding, and thus the bonding strength of the bonding surface between a spacer and the substrate is increased to improve the reliability thereof.

Dependencies are inferred from the claim text.