Method and apparatus for manufacturing interconnects with fine lines and spacing

A method of making fine line and spacing interconnects for electronic packaging, comprising the steps of:

• surrounding an imaged substrate with an electrolyte;
• contacting metal on the imaged substrate with electrically conductive fibers of a brush;
• connecting said electrically conductive fibers to a power source;
• and
• moving said brush in vibratory motion relative to a plane of the imaged substrate.

The method of etching an imaged substrate having exposed metal portions to form fine line and space interconnections, comprising the steps of:

• contacting the imaged substrate with a plurality of electrically conductive fibers;
• applying a first polarity electric potential to said plurality of electrically conductive fibers;
• applying second polarity electric potential in proximity to said plurality of electrically conductive fibers;
• moving said plurality of electrically conductive fibers across a plane of the imaged substrate, applying a uniform pressure to electrically etch and remove exposed portions.

A method of electroforming a fine-line and space interconnecting pattern on a substrate, comprising the steps of:

• creating a negative photo-resist pattern on the substrate;
• sensitizing exposed portions of the substrate with an electroless activator;
• and
• depositing a conductive material on said exposed portions of the substrate with a uniform fibrous material, wherein said fibrous material comprises a plurality of electrically conductive fibers, said step of depositing comprising the steps of:
• applying a first polarity electrical potential to said plurality of electrically conductive fibers;
• applying a second polarity electrical potential in proximity to said plurality of electrically conductive fibers to generate a uniform electric field over the surface of the substrate;
• and
• contacting the fibers over the surface of the substrate with a uniform pressure.

A method of making fine line and spacing interconnects comprising the steps of:

• surrounding a substrate having a developed photo-resist pattern thereon with an etching solution;
• applying fibers to metal on the substrate through said etching solution with a uniform pressure and uniform etching solution distribution to produce fine spacing and lines on the substrate;
• and
• moving said fibers across the surface of the substrate with a vibratory motion parallel to a plane of the substrate surface.

A method of making fine line and space interconnects comprising the steps of:

• applying an etching solution to an imaged substrate;
• contacting the imaged substrate with a brush applying uniform pressure and providing uniform distribution of the etching solution;
• and
• moving said brush in a vibratory motion parallel to a plane of the imaged substrate.