Low cost substrates
AssigneeInvensas Corporation
InventorsCyprian Emeka Uzoh, Arkalgud R. Sitaram
Life of this patent
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Abstract
A mask is formed over a first conductive portion of a conductive layer to expose a second conductive portion of the conductive layer. An electrolytic process is performed to remove conductive material from a first region and a second region of the second conductive portion. The second region is aligned with the mask relative to an electric field applied by the electrolytic process. The second region separates the first region of the second conductive portion from the first conductive portion. The electrolytic process is concentrated relative to the second region such that removal occurs at a relatively higher rate in the second region than in the first region.
Claims14
An interposer, comprising:
- an interconnect structure having a first surface and a second surface opposite the first surface, including:
- at least two electrically conductive vias extending from the first surface to the second surface;
- an embedded region extending between adjacent ones of the at least two electrically conductive vias, the embedded region being a thermal conductor, the embedded region and the at least two electrically conductive vias comprising a common metal and formed from a common metallic layer, the common metal of the embedded region being a continuous metal layer that completely surrounds each of the adjacent ones of the at least two electrically conductive vias;
- an electrically insulative layer separating thermally conductive material of the embedded region from the at least two electrically conductive vias.
Dependencies are inferred from the claim text.