H05K 3/068
Apparatus for etching printed circuits
Official title: {Apparatus for etching printed circuits}
H05K3/068 (Apparatus for etching printed circuits) appears on 101 US grants and 71 published applications in this corpus.
Search patents in H05K- Granted patents
- 101
- Published applications
- 71
- Assignees
- 66
- Inventors
- 192
- Latest grant
- 1 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 3 | 0 |
| 1977 | 1 | 0 |
| 1978 | 2 | 0 |
| 1979 | 0 | 0 |
| 1980 | 3 | 0 |
| 1981 | 1 | 0 |
| 1982 | 2 | 0 |
| 1983 | 2 | 0 |
| 1984 | 2 | 0 |
| 1985 | 2 | 0 |
| 1986 | 1 | 0 |
| 1987 | 0 | 0 |
| 1988 | 3 | 0 |
| 1989 | 2 | 0 |
| 1990 | 7 | 0 |
| 1991 | 9 | 0 |
| 1992 | 3 | 0 |
| 1993 | 4 | 0 |
| 1994 | 2 | 0 |
| 1995 | 1 | 0 |
| 1996 | 0 | 0 |
| 1997 | 2 | 0 |
| 1998 | 1 | 0 |
| 1999 | 2 | 0 |
| 2000 | 1 | 0 |
| 2001 | 2 | 1 |
| 2002 | 0 | 2 |
| 2003 | 0 | 1 |
| 2004 | 0 | 1 |
| 2005 | 1 | 1 |
| 2006 | 1 | 2 |
| 2007 | 1 | 1 |
| 2008 | 1 | 7 |
| 2009 | 1 | 3 |
| 2010 | 1 | 3 |
| 2011 | 0 | 1 |
| 2012 | 2 | 6 |
| 2013 | 3 | 2 |
| 2014 | 2 | 5 |
| 2015 | 2 | 2 |
| 2016 | 6 | 5 |
| 2017 | 0 | 3 |
| 2018 | 3 | 3 |
| 2019 | 3 | 2 |
| 2020 | 0 | 4 |
| 2021 | 1 | 4 |
| 2022 | 3 | 5 |
| 2023 | 2 | 3 |
| 2024 | 6 | 2 |
| 2025 | 3 | 2 |
| 2026 | 1 | 0 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Method for manufacturing printed circuit boards1 Sep 2026US 12,727,090 B2Gebr. Schmid GmbH & Co.
- Wafer processing method14 Oct 2025US 12,444,657 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Device for etching the periphery edge of a substrate and method for controlling etching thereof19 Aug 2025US 12,396,103 B2Device Co., Ltd.
- Etching device and etching method using the same4 Feb 2025US 12,217,978 B2Samsung Display Co., Ltd.
- Semi-automatic corrosion box of copper clad laminate24 Sep 2024US 12,101,892 B2Dalian University of Technology
- Wafer processing method20 Nov 2025US 2025/0357218 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Circuit board, method for manufacturing circuit pattern, and etching device5 Jun 2025US 2025/0185177 A1NHK Spring Co., Ltd.
- Method for manufacturing printed circuit boards9 May 2024US 2024/0155773 A1Gebr. Schmid GmbH & Co.
- Method for structuring metal-ceramic substrates, and structured metal ceramic substrate29 Feb 2024US 2024/0074064 A1Heraeus Deutschland GmbH & Co. KG
- Wafer processing method9 Nov 2023US 2023/0360977 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- Demetallizing procedure181US 5,340,436 ABeckett Industries Inc. · 1994
- Demetallizing procedure175US 5,266,386 ABeckett Industries Inc. · 1993
- Demetallizing procedure173US 5,628,921 ABeckett Technologies Corp. · 1997
- Structure with etchable metal169US 5,672,407 ABeckett Technologies Corp. · 1997
- Formation of packaging material94US 4,398,994 A1983