US 12,727,090 B2 · Method for manufacturing printed circuit boards

Abstract

A method of manufacturing printed circuit boards includes some or all of: chemically or electrically applying metallic layers to a substrate; incorporating bores into the substrate; through-contacting the bores incorporated into the substrate; applying a layer from a photoresist to an electrically conducting layer in a masking step; exposing the photoresist while using an exposure mask in an exposing step; removing exposed or unexposed regions of the layer from the photoresist while in regions laying bare the electrically conducting layer in a developing step; removing the laid-bare regions of the electrically conducting layer in an etching step; cleaning the substrate in a rinsing step; and drying the substrate, wherein the substrate for carrying out the developing step and/or the etching step is set in rotation and a developer solution and/or an etching liquid is applied to the rotating substrate by at least one nozzle.

Claims12

Dependent claims

A method for manufacturing a printed circuit board by processing a substrate the substrate having a carrier layer from an electrically insulating material and an electrically conducting layer applied thereto, wherein the method comprises:

a. rotating the substrate and applying a liquid processing medium to the rotating substrate by means of a first nozzle and a second nozzle, wherein the substrate is vertically disposed;
b. wherein the liquid processing medium is applied by spraying a front side of the rotating substrate with the liquid processing medium by means of the first nozzle mounted on a pivotable arm, and spraying a rear side of the rotating substrate with the liquid processing medium by means of the second nozzle mounted on another pivotable arm;
c. varying the position of the first nozzle relative to the rotation axis of the rotating substrate along an arc by pivoting movement of the arm when carrying out the spraying;
and
d. varying the position of the second nozzle relative to the rotation axis of the rotating substrate along an arc by pivoting movement of an arm about a pivot axis located outside the rotation axis of the substrate;
wherein the liquid processing medium is applied to substantially the entire front side and substantially the entire rear side of the rotating substrate.

3 more elements

Dependencies are inferred from the claim text.

Method for manufacturing printed circuit boards

Life of this patent

Method for manufacturing printed circuit boards

Life of this patent

Abstract

Claims12