H05K 3/067
Etchants
Official title: {Etchants}
H05K3/067 (Etchants) appears on 304 US grants and 257 published applications in this corpus.
Search patents in H05K- Granted patents
- 304
- Published applications
- 257
- Assignees
- 202
- Inventors
- 773
- Latest grant
- 8 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 3 | 0 |
| 1977 | 2 | 0 |
| 1978 | 2 | 0 |
| 1979 | 4 | 0 |
| 1980 | 5 | 0 |
| 1981 | 4 | 0 |
| 1982 | 2 | 0 |
| 1983 | 5 | 0 |
| 1984 | 2 | 0 |
| 1985 | 3 | 0 |
| 1986 | 4 | 0 |
| 1987 | 6 | 0 |
| 1988 | 3 | 0 |
| 1989 | 4 | 0 |
| 1990 | 9 | 0 |
| 1991 | 4 | 0 |
| 1992 | 4 | 0 |
| 1993 | 4 | 0 |
| 1994 | 7 | 0 |
| 1995 | 7 | 0 |
| 1996 | 3 | 0 |
| 1997 | 4 | 0 |
| 1998 | 5 | 0 |
| 1999 | 7 | 0 |
| 2000 | 5 | 0 |
| 2001 | 7 | 1 |
| 2002 | 6 | 5 |
| 2003 | 5 | 7 |
| 2004 | 4 | 6 |
| 2005 | 4 | 6 |
| 2006 | 3 | 8 |
| 2007 | 5 | 13 |
| 2008 | 8 | 6 |
| 2009 | 6 | 8 |
| 2010 | 2 | 8 |
| 2011 | 6 | 10 |
| 2012 | 2 | 5 |
| 2013 | 9 | 8 |
| 2014 | 6 | 19 |
| 2015 | 13 | 19 |
| 2016 | 15 | 13 |
| 2017 | 9 | 18 |
| 2018 | 11 | 11 |
| 2019 | 15 | 11 |
| 2020 | 7 | 18 |
| 2021 | 8 | 12 |
| 2022 | 14 | 11 |
| 2023 | 6 | 12 |
| 2024 | 10 | 14 |
| 2025 | 8 | 6 |
| 2026 | 7 | 2 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Enhanced subtractive etch anisotropy using etch rate gradient8 Sep 2026US 12,733,107 B2Intel Corporation
- Solvent free copper extraction18 Aug 2026US 12,709,784 B2GreenSource Fabrication LLC
- Wiring substrate and method for manufacturing the same11 Aug 2026US 12,707,560 B2Ibiden Co., Ltd.
- Metal residue removing liquid, metal residue removing method, and metal wiring manufacturing method16 Jun 2026US 12,655,370 B2Tokyo Ohka Kogyo.Co., Ltd.
- Etching composition, method of etching metal-containing film by using the same, and method of preparing semiconductor device by using the same12 May 2026US 12,624,285 B2Samsung Electronics Co., Ltd.
- Wiring substrate and method for manufacturing the same24 Sep 2026US 2026/0292976 A1Ibiden Co., Ltd.
- Transparent Conductive Circuit26 Feb 2026US 2026/0059660 A1Chasm Advanced Materials, Inc.
- Method for nano etching of copper and copper alloy surfaces9 Oct 2025US 2025/0313958 A1Atotech Deutschland GmbH
- Process for etching circuit board with alkaline tetraamminecopper (ii) sulfate and apparatus therefor18 Sep 2025US 2025/0290205 A1
- Solvent free copper extraction3 Jul 2025US 2025/0220820 A1GreenSource Fabrication LLC
Most cited
By later US patents
- Etching of metallic composite articles159US 6,468,439 B1BMC Industries, Inc. · 2002
- Applying solder to high density substrates139US 5,316,788 AInternational Business Machines Corporation · 1994
- Circuit manufacturing using etched tri-metal media125US 6,365,057 B1BMC Industries, Inc. · 2002
- Lamination of circuit sub-elements while assuring registration120US 6,409,930 B1BMC Industries, Inc. · 2002
- Method of building solder bumps114US 4,950,623 AMicroelectronics Center of North Carolina · 1990