Solvent free copper extraction

Abstract

The system and method described herein provides a system and method for using ion-exchange resins to remove excess copper during processes such as PCB (Printed Circuit Board) fabrication using cupric chloride etchants. Cu+2 is used to oxidize solid copper producing two Cu+ ions. During operation, the etchant is overloaded with copper ions and an extraction system is implemented to control the concentration and remove excess copper. Traditional systems use liquid extractions but these systems can be costly and use hazardous solvents. Ion-exchange resins serve as a solution for controlling the concentration, absorbing metal ions and retaining them until desorption. The system and method further determines the effectiveness of the resin in removing the copper based on performing adsorption and desorption at varying flow rates. The results showed that the resin effectively removes copper at various flowrates, removing an average of 10.06 g/l Cu from a bulk value of three beds of etchant.

Dependencies are inferred from the claim text.