H05K 3/061
Etching masks
Official title: {Etching masks}
H05K3/061 (Etching masks) appears on 1,389 US grants and 1,062 published applications in this corpus.
Search patents in H05K- Granted patents
- 1,389
- Published applications
- 1,062
- Assignees
- 584
- Inventors
- 2,914
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 12 | 0 |
| 1977 | 11 | 0 |
| 1978 | 10 | 0 |
| 1979 | 7 | 0 |
| 1980 | 10 | 0 |
| 1981 | 15 | 0 |
| 1982 | 15 | 0 |
| 1983 | 13 | 0 |
| 1984 | 14 | 0 |
| 1985 | 18 | 0 |
| 1986 | 17 | 0 |
| 1987 | 21 | 0 |
| 1988 | 30 | 0 |
| 1989 | 24 | 0 |
| 1990 | 27 | 0 |
| 1991 | 32 | 0 |
| 1992 | 27 | 0 |
| 1993 | 34 | 0 |
| 1994 | 26 | 0 |
| 1995 | 33 | 0 |
| 1996 | 31 | 0 |
| 1997 | 21 | 0 |
| 1998 | 35 | 0 |
| 1999 | 25 | 0 |
| 2000 | 29 | 0 |
| 2001 | 38 | 26 |
| 2002 | 54 | 37 |
| 2003 | 58 | 64 |
| 2004 | 41 | 60 |
| 2005 | 34 | 54 |
| 2006 | 31 | 48 |
| 2007 | 31 | 57 |
| 2008 | 23 | 58 |
| 2009 | 35 | 65 |
| 2010 | 28 | 32 |
| 2011 | 28 | 34 |
| 2012 | 35 | 29 |
| 2013 | 29 | 24 |
| 2014 | 22 | 19 |
| 2015 | 26 | 42 |
| 2016 | 33 | 49 |
| 2017 | 34 | 66 |
| 2018 | 50 | 51 |
| 2019 | 41 | 41 |
| 2020 | 46 | 32 |
| 2021 | 19 | 28 |
| 2022 | 22 | 36 |
| 2023 | 31 | 33 |
| 2024 | 25 | 32 |
| 2025 | 24 | 25 |
| 2026 | 14 | 20 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Method for integrating a copper-graphene laminate (CGL) in a multilayer PCB fabrication process6 Oct 2026US 12,757,335 B2Bar-Ilan University
- Wiring circuit board having a conductive layer with a via portion15 Sep 2026US 12,739,981 B2Nitto Denko Corporation
- Methods of forming interconnect circuits methods15 Sep 2026US 12,739,982 B2CelLink Corporation
- Enhanced subtractive etch anisotropy using etch rate gradient8 Sep 2026US 12,733,107 B2Intel Corporation
- Electronic device and manufacturing method thereof8 Sep 2026US 12,733,523 B2Innolux Corporation
- Photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for producing printed wiring board1 Oct 2026US 2026/0299414 A1Resonac Corporation
- Photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for manufacturing wiring substrate1 Oct 2026US 2026/0299416 A1Resonac Corporation
- Photosensitive element, method for forming resist pattern, and method for manufacturing printed wiring board1 Oct 2026US 2026/0304638 A1Resonac Corporation
- Wiring substrate and method for manufacturing the same24 Sep 2026US 2026/0292976 A1Ibiden Co., Ltd.
- Photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for producing printed wiring board17 Sep 2026US 2026/0282237 A1Resonac Corporation
Most cited
By later US patents
- Formation of microstamped patterns on surfaces and derivative articles1,049US 5,512,131 APresident and Fellows of Harvard College · 1996
- Method of forming articles including waveguides via capillary micromolding and microtransfer molding512US 6,355,198 B1President and Fellows of Harvard College · 2002
- Step and flash imprint lithography459US 6,334,960 B12002
- Flexible circuits for electrosurgical instrument378US 10,555,769 B2Ethicon, Inc. · 2020
- High-density, multi-level interconnects, flex circuits, and tape for tab285US 5,106,461 AMassachusetts Institute of Technology · 1992