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US 2026/0282237 A1Published application
Photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for producing printed wiring board
AssigneeResonac Corporation
InventorsNatsuki TODA, Taku SAWAKI, Kensuke YOSHIHARA, Yosuke KAGUCHI, Hiroshi ONO, Yusaku WATANABE
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Abstract
A photosensitive resin composition according to an aspect of the present disclosure contains a binder polymer, a photopolymerizable compound, a photopolymerization initiator, and a sensitizer, in which the binder polymer has a structural unit derived from acrylic acid, and the sensitizer includes an anthracene compound.
Claims8
A photosensitive resin composition comprising:
- a binder polymer;
- a photopolymerizable compound;
- a photopolymerization initiator;
- and
- a sensitizer,
- wherein the binder polymer has a structural unit derived from acrylic acid, and the sensitizer includes an anthracene compound.
3 more elements
Dependencies are inferred from the claim text.