H05K 3/064
Photoresists
Official title: {Photoresists}
H05K3/064 (Photoresists) appears on 692 US grants and 567 published applications in this corpus.
Search patents in H05K- Granted patents
- 692
- Published applications
- 567
- Assignees
- 345
- Inventors
- 1,654
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 8 | 0 |
| 1977 | 4 | 0 |
| 1978 | 3 | 0 |
| 1979 | 2 | 0 |
| 1980 | 5 | 0 |
| 1981 | 5 | 0 |
| 1982 | 4 | 0 |
| 1983 | 6 | 0 |
| 1984 | 5 | 0 |
| 1985 | 7 | 0 |
| 1986 | 6 | 0 |
| 1987 | 11 | 0 |
| 1988 | 11 | 0 |
| 1989 | 12 | 0 |
| 1990 | 13 | 0 |
| 1991 | 14 | 0 |
| 1992 | 11 | 0 |
| 1993 | 17 | 0 |
| 1994 | 14 | 0 |
| 1995 | 15 | 0 |
| 1996 | 10 | 0 |
| 1997 | 14 | 0 |
| 1998 | 19 | 0 |
| 1999 | 17 | 0 |
| 2000 | 17 | 0 |
| 2001 | 25 | 19 |
| 2002 | 25 | 19 |
| 2003 | 25 | 40 |
| 2004 | 18 | 24 |
| 2005 | 22 | 26 |
| 2006 | 15 | 23 |
| 2007 | 16 | 27 |
| 2008 | 10 | 31 |
| 2009 | 18 | 21 |
| 2010 | 14 | 12 |
| 2011 | 13 | 17 |
| 2012 | 11 | 8 |
| 2013 | 12 | 9 |
| 2014 | 9 | 5 |
| 2015 | 10 | 24 |
| 2016 | 12 | 29 |
| 2017 | 18 | 43 |
| 2018 | 32 | 33 |
| 2019 | 25 | 26 |
| 2020 | 30 | 22 |
| 2021 | 12 | 16 |
| 2022 | 14 | 25 |
| 2023 | 22 | 19 |
| 2024 | 14 | 20 |
| 2025 | 13 | 13 |
| 2026 | 7 | 16 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Method for integrating a copper-graphene laminate (CGL) in a multilayer PCB fabrication process6 Oct 2026US 12,757,335 B2Bar-Ilan University
- Methods of forming interconnect circuits methods15 Sep 2026US 12,739,982 B2CelLink Corporation
- Electronic device and manufacturing method thereof8 Sep 2026US 12,733,523 B2Innolux Corporation
- Method for manufacturing printed circuit boards1 Sep 2026US 12,727,090 B2Gebr. Schmid GmbH & Co.
- Wiring substrate and method for manufacturing the same11 Aug 2026US 12,707,560 B2Ibiden Co., Ltd.
- Photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for producing printed wiring board1 Oct 2026US 2026/0299414 A1Resonac Corporation
- Photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for manufacturing wiring substrate1 Oct 2026US 2026/0299416 A1Resonac Corporation
- Photosensitive element, method for forming resist pattern, and method for manufacturing printed wiring board1 Oct 2026US 2026/0304638 A1Resonac Corporation
- Wiring substrate and method for manufacturing the same24 Sep 2026US 2026/0292976 A1Ibiden Co., Ltd.
- Photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for producing printed wiring board17 Sep 2026US 2026/0282237 A1Resonac Corporation
Most cited
By later US patents
- Flexible electrical interconnect and method of making137US 4,991,290 AMicroelectronics and Computer Technology Corporation · 1991
- Printed circuit board having an injection molded substrate127US 4,996,391 ASiemens Aktiengesellschaft · 1991
- Etching method using a hardened PVA stencil122US 4,339,528 ARCA Corporation · 1982
- Method for producing laminated film/metal structures for known good die ("KG") applications119US 5,776,824 AMicron Technology, Inc. · 1998
- Excimer laser patterning of a novel resist114US 4,780,177 AGeneral Electric Company · 1988