Etching method using a hardened PVA stencil
AssigneeRCA Corporation
InventorAbraham Goldman
Life of this patent
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Abstract
The method comprises producing on the surface to be etched a stencil of a light-hardened PVA. The stencil is produced by light hardening selected portions of a film or coating consisting essentially of dichromate-sensitized PVA. The PVA is about 85% to 97% hydrolyzed and has a molecular weight of 75,000 to 100,000. After light hardening, the nonhardened portions of the film are removed, thereby producing the stencil. The stencil is baked to improve its etch resistance, the surface is etched through the stencil, and then the stencil is removed from the surface.
Claims10
In a method of etching a metal body including producing a stencil of a light-hardened poly(vinyl alcohol-acetate) on a surface of said body, baking said stencil to improve the resistance thereof to liquid etchant, etching said surface through said stencil with said etchant, baking said stencil after said etching and then removing said stencil from said surface,
- the improvement comprising constituting said stencil by light-hardening selected portions of a film consisting essentially of a dichromate-sensitized poly(vinyl alcohol-acetate) that is about 85% to 97% hydrolyzed and has a molecular weight of about 75,000 to 100,000, and then selectively removing the substantially nonhardened portions of said film.
In a method of etching selected areas of a surface of a metal body including producing an etch-resistant stencil of light-hardened PVA on said surface, baking said stencil to improve the resistance of said stencil to attack by liquid acid, etching said surface by contacting said baked stencil and said surface with said liquid acid until said selective etching is achieved, baking said stencil after said etching and then removing said stencil from said surface,
- the improvement comprising producing said stencil by light hardening selected portions of a film consisting essentially of dichromate-sensitized PVA that is about 85% to 97% hydrolyzed and has a molecular weight of about 75,000 to 100,000 and then removing the nonselected film portions while retaining said selected film portions in place, and wherein the baking of said stencil after said selective etching is limited to temperatures of less than 200.degree. C.
Dependencies are inferred from the claim text.