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US 2026/0304638 A1Published application
Photosensitive element, method for forming resist pattern, and method for manufacturing printed wiring board
AssigneeResonac Corporation
InventorsNatsuki TODA, Kei TOGASAKI, Kenichi IWASHITA, Kensuke YOSHIHARA, Yosuke KAGUCHI, Yusaku WATANABE
Life of this patent
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Abstract
A photosensitive element including: a support film, an optical adjustment layer, and a photosensitive layer in this order, in which the optical adjustment layer has an absorbance of 0.060 or less for light with a wavelength of 365 nm, and the optical adjustment layer has a refractive index of 1.800 or less for light with a wavelength of 365 nm.
Claims8
A photosensitive element comprising:
- a support film, an optical adjustment layer, and a photosensitive layer in this order,
- wherein the optical adjustment layer has an absorbance of 0.060 or less for light with a wavelength of 365 nm, and the optical adjustment layer has a refractive index of 1.800 or less for light with a wavelength of 365 nm.
Dependencies are inferred from the claim text.