H05K 3/062
Consisting of metals or alloys or metallic inorganic compounds
Official title: {consisting of metals or alloys or metallic inorganic compounds (H05K3/065 takes precedence)}
H05K3/062 (Consisting of metals or alloys or metallic inorganic compounds) appears on 357 US grants and 230 published applications in this corpus.
Search patents in H05K- Granted patents
- 357
- Published applications
- 230
- Assignees
- 191
- Inventors
- 689
- Latest grant
- 8 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 3 | 0 |
| 1977 | 4 | 0 |
| 1978 | 6 | 0 |
| 1979 | 3 | 0 |
| 1980 | 3 | 0 |
| 1981 | 5 | 0 |
| 1982 | 3 | 0 |
| 1983 | 4 | 0 |
| 1984 | 3 | 0 |
| 1985 | 6 | 0 |
| 1986 | 8 | 0 |
| 1987 | 7 | 0 |
| 1988 | 6 | 0 |
| 1989 | 3 | 0 |
| 1990 | 9 | 0 |
| 1991 | 9 | 0 |
| 1992 | 6 | 0 |
| 1993 | 4 | 0 |
| 1994 | 5 | 0 |
| 1995 | 8 | 0 |
| 1996 | 14 | 0 |
| 1997 | 3 | 0 |
| 1998 | 14 | 0 |
| 1999 | 8 | 0 |
| 2000 | 12 | 0 |
| 2001 | 11 | 10 |
| 2002 | 19 | 18 |
| 2003 | 29 | 17 |
| 2004 | 19 | 26 |
| 2005 | 9 | 18 |
| 2006 | 13 | 11 |
| 2007 | 11 | 19 |
| 2008 | 6 | 15 |
| 2009 | 11 | 22 |
| 2010 | 8 | 5 |
| 2011 | 8 | 9 |
| 2012 | 10 | 9 |
| 2013 | 5 | 4 |
| 2014 | 3 | 3 |
| 2015 | 5 | 3 |
| 2016 | 3 | 1 |
| 2017 | 2 | 4 |
| 2018 | 1 | 2 |
| 2019 | 4 | 5 |
| 2020 | 3 | 3 |
| 2021 | 2 | 5 |
| 2022 | 1 | 2 |
| 2023 | 3 | 7 |
| 2024 | 7 | 7 |
| 2025 | 5 | 3 |
| 2026 | 3 | 2 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Enhanced subtractive etch anisotropy using etch rate gradient8 Sep 2026US 12,733,107 B2Intel Corporation
- Wiring board21 Apr 2026US 12,610,465 B2Shinko Electric Industries Co., Ltd.
- Silver-based transparent conductive layers interfaced with copper traces and methods for forming the structures3 Mar 2026US 12,568,783 B2EKC Technology, Inc.
- Printed wiring board18 Nov 2025US 12,477,663 B2Ibiden Co., Ltd.
- Methods for producing an etch resist pattern on a metallic surface9 Sep 2025US 12,414,239 B2Kateeva, Inc.
- Circuit board and manufacturing method thereof11 Jun 2026US 2026/0164543 A1Samsung Electro-Mechanics Co., Ltd.
- Ultra-thin copper foil with carrier foil and method for manufacturing embedded substrate by using same29 Jan 2026US 2026/0032815 A1Lotte Energy Materials Corporation
- Methods for producing an etch resist pattern on a metallic surface4 Dec 2025US 2025/0374437 A1Kateeva, Inc.
- Stacked structure for circuit board21 Aug 2025US 2025/0267800 A1Unimicron Technology Corp.
- Methods And Systems Of Forming Metal Interconnect Layers Using Engineered Templates27 Feb 2025US 2025/0069900 A1
Most cited
By later US patents
- High-density, multi-level interconnects, flex circuits, and tape for tab285US 5,106,461 AMassachusetts Institute of Technology · 1992
- Economical high density chip carrier113US 6,753,612 B2International Business Machines Corporation · 2004
- Method for fabricating a wiring substrate by electroplating a wiring film on a metal base99US 6,782,610 B1North Inc. · 2004
- Fabrication of a printed circuit board with metal-filled channels97US 4,532,152 A1985
- Method for manufacturing printed circuit boards96US 4,943,346 ASiemens Aktiengesellschaft · 1990