Methods for producing an etch resist pattern on a metallic surface
AssigneeKateeva, Inc.
InventorsMoshe Frenkel, Nava Shpaisman
Life of this patent
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Abstract
Methods and composition sets for forming etch-resist masks on a metallic surface are provided. The method may include depositing a first aqueous composition comprising a first reactive component onto a metallic layer of a substrate; depositing a second aqueous composition comprising a second reactive component on selected portions of the deposited first aqueous composition to form, from a chemical reaction between the first reactive component and the second reactive component, a bi-component material mask in a pattern to protect selected regions of the metallic layer; and depositing an etch solution to remove the metallic layer in regions not protected by the bi-component material mask.
Claims19
A method comprising:
- depositing a first aqueous composition comprising a first reactive component comprising a reactive polymer, a long-chain quaternary amine, or a metal cation onto a substrate;
- depositing a second aqueous composition comprising a second reactive component comprising an anionic material onto the substrate, wherein, upon contact between the first aqueous composition and the second aqueous composition, the first reactive component chemically reacts with the second reactive component to form an immobilized bi-component mask, wherein one or more of depositing the first aqueous composition and depositing the second aqueous composition is a patterned deposition comprising non-impact printing, and one or more of the first aqueous composition and the second aqueous composition is deposited directly onto a metallic layer of the substrate;
- removing unreacted portions of the first aqueous composition, the second aqueous composition, or both to expose portions of the metallic layer;
- and
- depositing an etch solution to remove the exposed portions of the metallic layer.
A method comprising:
- depositing a first aqueous composition comprising a first reactive component directly onto a metallic layer of a substrate;
- depositing a second aqueous composition comprising a second reactive component onto the substrate in contact with the first aqueous composition, wherein upon contact the first and the second reactive components undergo a chemical reaction to form an immobilized bi-component mask, wherein depositing the first aqueous composition comprises non-impact printing, depositing the second aqueous composition comprises non-impact printing, or both;
- removing unreacted material from the substrate to expose portions of the metallic layer;
- and
- applying an etch solution to the substrate to remove the exposed portions of the metallic layer,
- wherein each of the first and second reactive components comprises a material chosen from the group consisting of reactive polymers, long-chain quaternary amines, a metal cation, and an anionic component.
Dependencies are inferred from the claim text.