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US 2026/0164543 A1Published application
Circuit board and manufacturing method thereof
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorTaekyun Bae
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Abstract
A circuit board according to an embodiment includes: an insulating layer; a primer layer that is disposed on the insulating layer and includes a first uneven portion; and a conductive line that is disposed on the first uneven portion of the primer layer. The conductive line includes: a first conductive line including a second uneven portion corresponding to the first uneven portion; and a second conductive line disposed on the first conductive line.
Claims16
A circuit board comprising:
- an insulating layer;
- a primer layer that is disposed on the insulating layer and includes a first uneven portion;
- and
- a conductive line that is disposed on the first uneven portion of the primer layer,
- wherein the conductive line comprises:
- a first conductive line including a second uneven portion corresponding to the first uneven portion;
- and
- a second conductive line disposed on the first conductive line.
5 more elements
A manufacturing method of a circuit board, comprising:
- preparing an insulating layer, and sequentially stacking, on the insulating layer, a primer layer including a first uneven portion, and a first conductive layer including a second uneven portion corresponding to the first uneven portion;
- forming a seed layer on the first conductive layer;
- exposing a first portion of the seed layer on the seed layer and forming a pattern mask that covers a second portion of the seed layer;
- forming a plating line on the first portion of the seed layer;
- removing the pattern mask;
- and
- forming a conductive line comprising removing the second portion of the seed layer and the first conductive layer below the second portion of the seed layer.
4 more elements
Dependencies are inferred from the claim text.