Material selection assistance device, circuit board manufacturing method, circuit board core, and circuit board

Abstract

A relationship estimation unit (32) estimates a correspondence relationship between a combination of a thermal expansion coefficient and a modulus of elasticity of a circuit board core and a combination of a thermal expansion coefficient and a modulus of elasticity of a circuit board using the circuit board core. A reception unit (34) receives a thermal expansion coefficient of a substrate to be joined by solder to the circuit board. A reliability estimation unit (36) estimates a reliability of solder for a case in which the substrate and the circuit board are joined by the solder for each combination of thermal expansion coefficient and modulus of elasticity of the circuit board. A calculation unit (38), based on the correspondence relationship, calculates a range of combinations of thermal expansion coefficient and modulus of elasticity of the circuit board core corresponding to combinations of thermal expansion coefficient and modulus of elasticity of the circuit board that achieve at least a specific value for the reliability.

Dependencies are inferred from the claim text.