H05K 3/04
The conductive material being removed mechanically
Official title: the conductive material being removed mechanically, e.g. by punching
H05K3/04 (The conductive material being removed mechanically) appears on 820 US grants and 738 published applications in this corpus.
Search patents in H05K- Granted patents
- 820
- Published applications
- 738
- Assignees
- 487
- Inventors
- 1,908
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 4 | 0 |
| 1977 | 3 | 0 |
| 1978 | 3 | 0 |
| 1979 | 2 | 0 |
| 1980 | 6 | 0 |
| 1981 | 5 | 0 |
| 1982 | 9 | 0 |
| 1983 | 8 | 0 |
| 1984 | 8 | 0 |
| 1985 | 19 | 0 |
| 1986 | 6 | 0 |
| 1987 | 13 | 0 |
| 1988 | 10 | 0 |
| 1989 | 14 | 0 |
| 1990 | 11 | 0 |
| 1991 | 9 | 0 |
| 1992 | 11 | 0 |
| 1993 | 11 | 0 |
| 1994 | 11 | 0 |
| 1995 | 12 | 0 |
| 1996 | 8 | 0 |
| 1997 | 12 | 0 |
| 1998 | 22 | 0 |
| 1999 | 16 | 0 |
| 2000 | 26 | 0 |
| 2001 | 29 | 12 |
| 2002 | 23 | 34 |
| 2003 | 20 | 26 |
| 2004 | 28 | 33 |
| 2005 | 18 | 37 |
| 2006 | 19 | 41 |
| 2007 | 19 | 51 |
| 2008 | 22 | 50 |
| 2009 | 13 | 46 |
| 2010 | 38 | 44 |
| 2011 | 29 | 36 |
| 2012 | 28 | 32 |
| 2013 | 19 | 17 |
| 2014 | 17 | 18 |
| 2015 | 23 | 25 |
| 2016 | 19 | 23 |
| 2017 | 17 | 25 |
| 2018 | 20 | 18 |
| 2019 | 27 | 22 |
| 2020 | 23 | 29 |
| 2021 | 25 | 39 |
| 2022 | 23 | 19 |
| 2023 | 20 | 20 |
| 2024 | 19 | 12 |
| 2025 | 16 | 16 |
| 2026 | 7 | 13 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
- H05K 3/046By selective transfer or selective detachment of a conductive layer414
- H05K 3/045By making a conductive layer having a relief pattern, followed by abrading180
- H05K 3/041By using a die for cutting the conductive material108
- H05K 3/043By using a moving tool for milling or cutting the conductive material81
Recent patents
- Tape processing method6 Oct 2026US 12,757,333 B2Chipbond Technology Corporation
- Methods of forming interconnect circuits methods15 Sep 2026US 12,739,982 B2CelLink Corporation
- Silver nanowire thin-film patterning method25 Aug 2026US 12,721,113 B2Seoul National University R&Db Foundation
- Method for producing wiring board25 Aug 2026US 12,721,211 B2Mitsui Kinzoku Company, Limited
- Method and structure for alignment of lens to optical product at PCBA level9 Jun 2026US 12,652,754 B2Pixart Imaging Inc.
- Printed circuit board and manufacturing method thereof1 Oct 2026US 2026/0304620 A1LG Electronics Inc.
- Manufacturing method for long circuit board and long circuit board1 Oct 2026US 2026/0304643 A1
- Deposition apparatus, method for depositing, method for packaging a die in a chip package30 Jul 2026US 2026/0218369 A1Nederlandse Organisatie voor toegepast-natuurwetenschappelijk onderzoek TNO
- Method for manufacturing wiring structure2 Jul 2026US 2026/0190246 A1Resonac Corporation
- Method for manufacturing wiring structure2 Jul 2026US 2026/0191025 A1Resonac Corporation
Most cited
By later US patents
- Electroless CU deposition on a barrier layer by CU contact displacement for ULSI applications448US 5,891,513 ACornell Research Foundation, Inc. · 1999
- Method for producing coplanar multi-level metal/insulator films on a substrate and for forming patterned conductive lines simultaneously with stud vias406US 4,789,648 AInternational Business Machines Corporation · 1988
- Patterned metal foil laminate and method for making same201US 5,759,422 AFort James Corporation · 1998
- Structure having laser ablated features and method of fabricating179US 6,730,857 B2International Business Machines Corporation · 2004
- Circuit wiring disposed on solder mask coating161US 4,706,167 ATelemark Co., Inc. · 1987