Method for manufacturing wiring structure
AssigneeResonac Corporation
InventorKei TOGASAKI
Life of this patent
Estimating the term…
Abstract
A method of manufacturing a wiring structure by a novel wiring forming method includes forming a trench including a bottom surface including a surface of a substrate and a wall surface including a surface of a resist layer, forming a seed layer including an in-trench seed portion continuously formed from a position on the bottom surface to a position on the wall surface in the trench, forming a metal plating layer on the seed layer, the metal plating layer including a filling plating portion filling the trench together with the in-trench seed portion, and removing the resist layer so that wiring including the in-trench seed portion and the filling plating portion remains.
Claims4
A method for manufacturing a wiring structure, the method comprising:
- providing a resist layer on one main surface of a substrate;
- patterning the resist layer by exposure and development to form a trench comprising a bottom surface including a surface of the substrate and a wall surface including a surface of the resist layer;
- forming a seed layer comprising an in-trench seed portion continuously formed from a position on the bottom surface to a position on the wall surface in the trench, and an out-of-trench seed portion provided on a side opposite to the substrate of the resist layer and continuously formed with the in-trench seed portion;
- forming a metal plating layer on the seed layer, the metal plating layer comprising a filling plating portion filling the trench together with the in-trench seed portion and a portion provided on the out-of-trench seed portion;
- removing a part of the metal plating layer and the out-of-trench seed portion so that the resist layer is exposed and the filling plating portion remains;
- and
- removing the resist layer from the main surface of the substrate so that wiring comprising the in-trench seed portion and the filling plating portion remains.
Dependencies are inferred from the claim text.