H05K 3/043
By using a moving tool for milling or cutting the conductive material
Official title: {by using a moving tool for milling or cutting the conductive material}
H05K3/043 (By using a moving tool for milling or cutting the conductive material) appears on 81 US grants and 70 published applications in this corpus.
Search patents in H05K- Granted patents
- 81
- Published applications
- 70
- Assignees
- 75
- Inventors
- 191
- Latest grant
- 2 Jun 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1979 | 1 | 0 |
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 1 | 0 |
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 3 | 0 |
| 1988 | 1 | 0 |
| 1989 | 0 | 0 |
| 1990 | 1 | 0 |
| 1991 | 0 | 0 |
| 1992 | 3 | 0 |
| 1993 | 0 | 0 |
| 1994 | 2 | 0 |
| 1995 | 1 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 2 | 0 |
| 2001 | 2 | 0 |
| 2002 | 3 | 0 |
| 2003 | 4 | 0 |
| 2004 | 1 | 3 |
| 2005 | 1 | 1 |
| 2006 | 2 | 3 |
| 2007 | 1 | 3 |
| 2008 | 1 | 1 |
| 2009 | 0 | 1 |
| 2010 | 1 | 2 |
| 2011 | 2 | 1 |
| 2012 | 0 | 0 |
| 2013 | 2 | 1 |
| 2014 | 0 | 1 |
| 2015 | 1 | 4 |
| 2016 | 1 | 5 |
| 2017 | 2 | 3 |
| 2018 | 1 | 1 |
| 2019 | 3 | 2 |
| 2020 | 3 | 5 |
| 2021 | 7 | 12 |
| 2022 | 4 | 9 |
| 2023 | 7 | 4 |
| 2024 | 6 | 2 |
| 2025 | 7 | 3 |
| 2026 | 1 | 3 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Circuit board having an edge containing conductive regions2 Jun 2026US 12,648,082 B2Teradyne, Inc.
- Electroplating edge connector pins of printed circuit boards without using tie bars25 Nov 2025US 12,484,156 B2NVIDIA Corporation
- Easy-to-assemble large-current composite circuit board and manufacturing process therefor7 Oct 2025US 12,439,510 B1
- Milling of flex foil with two conductive layers from both sides12 Aug 2025US 12,389,548 B2Dp Patterning AB
- Method of manufacturing electronic component22 Jul 2025US 12,369,254 B2Murata Manufacturing Co., Ltd.
- Printed circuit board and manufacturing method thereof1 Oct 2026US 2026/0304620 A1LG Electronics Inc.
- Electroplating edge connector pins of printed circuit boards without using tie bars19 Mar 2026US 2026/0082490 A1NVIDIA Corporation
- Printed circuit board manufacturing method and printed circuit board22 Jan 2026US 2026/0025926 A1Ruijie Networks Co., Ltd.
- Methods Of Manufacture Of A Compact Phased Array Antenna6 Mar 2025US 2025/0081355 A1Battelle Memorial Institute
- Circuit board having an edge containing conductive regions20 Feb 2025US 2025/0063664 A1Teradyne, Inc.
Most cited
By later US patents
- Multi-connection via with electrically isolated segments154US 6,388,208 B1Teradyne, Inc. · 2002
- Split via surface mount connector and related techniques72US 6,137,064 ATeradyne, Inc. · 2000
- Fabric circuits and method of manufacturing fabric circuits23US 8,022,307 B2The United States of America as represented by the Administrator of the National Aeronautics and Space Administration · 2011
- Circuit board pins21US 5,133,669 ANorthern Telecom Limited · 1992
- Magneto-dielectric substrate, circuit material, and assembly having the same16US 9,596,755 B2Rogers Corporation · 2017