Method of manufacturing electronic component

A method of manufacturing an electronic component, the method comprising:

• applying a Cu paste along a width direction to two coating positions which are spaced apart by a constant distance in a length direction on a board main surface of an elongated board made of alumina;
• applying a glass paste including Si between the two coating positions;
• heating the board to fire the Cu paste and the glass paste, and form a Cu fired layer and a mark portion including Si and a fired glass layer;
• cutting two locations where the Cu fired layer is provided on the board in a plane perpendicular or substantially perpendicular to the length direction to form an interposer board;
• forming a Cu layer on an outer periphery of the interposer board at both ends in the length direction of the interposer board;
• forming a Ni plated layer on an outer periphery of the Cu layer;
• forming a Sn plated layer on an outer periphery of the Ni plated layer;
• providing a solder on the board main surface at a predetermined position of the electronic component;
• and
• providing the electronic element on the board main surface and attaching the electronic element to the interposer board;
• wherein
• the electronic element includes a rectangular or substantially rectangular multilayer body including dielectric layers and internal electrode layers which are alternately laminated, a pair of multilayer body end surfaces orthogonal or substantially orthogonal to the internal electrode layers, a pair of multilayer body side surfaces orthogonal or substantially orthogonal to the multilayer body end surfaces, and a pair of multilayer body main surfaces orthogonal or substantially orthogonal to the multilayer body end surfaces and the multilayer body side surfaces, and external electrodes each on a respective one of the pair of multilayer body end surfaces of the multilayer body and connected to the internal electrode layers;
• and
• each of the forming the Cu layer, the forming the Ni plated layer, and the forming the Sn layer is performed after the cutting two locations.