H05K 3/045
By making a conductive layer having a relief pattern, followed by abrading
Official title: {by making a conductive layer having a relief pattern, followed by abrading of the raised portions}
H05K3/045 (By making a conductive layer having a relief pattern, followed by abrading) appears on 180 US grants and 178 published applications in this corpus.
Search patents in H05K- Granted patents
- 180
- Published applications
- 178
- Assignees
- 122
- Inventors
- 407
- Latest grant
- 12 Aug 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1980 | 2 | 0 |
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 4 | 0 |
| 1986 | 1 | 0 |
| 1987 | 3 | 0 |
| 1988 | 2 | 0 |
| 1989 | 1 | 0 |
| 1990 | 1 | 0 |
| 1991 | 1 | 0 |
| 1992 | 2 | 0 |
| 1993 | 2 | 0 |
| 1994 | 2 | 0 |
| 1995 | 2 | 0 |
| 1996 | 3 | 0 |
| 1997 | 5 | 0 |
| 1998 | 6 | 0 |
| 1999 | 5 | 0 |
| 2000 | 6 | 0 |
| 2001 | 3 | 4 |
| 2002 | 4 | 10 |
| 2003 | 4 | 8 |
| 2004 | 13 | 10 |
| 2005 | 4 | 7 |
| 2006 | 1 | 9 |
| 2007 | 7 | 15 |
| 2008 | 6 | 12 |
| 2009 | 4 | 14 |
| 2010 | 7 | 11 |
| 2011 | 9 | 13 |
| 2012 | 13 | 12 |
| 2013 | 7 | 8 |
| 2014 | 5 | 5 |
| 2015 | 4 | 4 |
| 2016 | 7 | 6 |
| 2017 | 5 | 6 |
| 2018 | 3 | 4 |
| 2019 | 6 | 7 |
| 2020 | 7 | 3 |
| 2021 | 2 | 5 |
| 2022 | 2 | 2 |
| 2023 | 5 | 1 |
| 2024 | 1 | 1 |
| 2025 | 1 | 0 |
| 2026 | 0 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Milling of flex foil with two conductive layers from both sides12 Aug 2025US 12,389,548 B2Dp Patterning AB
- Redistribution plate28 May 2024US 11,997,789 B2
- Milling of flex foil with two conductive layers from both sides19 Dec 2023US 11,849,544 B2Gentherm Incorporated
- Dual conductor laminated substrate29 Aug 2023US 11,744,023 B2Gentherm Incorporated
- Wiring substrate1 Aug 2023US 11,715,698 B2Ibiden Co., Ltd.
- Component Carrier With Embedded Trace Having Lateral Walls Slanted Inwardly Beginning From an Exterior Surface And Having An Opposing Rounded Edge14 May 2026US 2026/0136969 A1AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Printed circuit board manufacturing process and printed circuit board26 Dec 2024US 2024/0431034 A1Gebr. Schmid GmbH & Co.
- Redistribution plate23 Feb 2023US 2023/0054628 A1
- Wiring substrate14 Jul 2022US 2022/0223532 A1Ibiden Co., Ltd.
- Milling of flex foil with two conductive layers from both sides16 Jun 2022US 2022/0192028 A1Gentherm Incorporated
Most cited
By later US patents
- Electroless CU deposition on a barrier layer by CU contact displacement for ULSI applications448US 5,891,513 ACornell Research Foundation, Inc. · 1999
- Structure having laser ablated features and method of fabricating179US 6,730,857 B2International Business Machines Corporation · 2004
- Circuit wiring disposed on solder mask coating161US 4,706,167 ATelemark Co., Inc. · 1987
- Structure having laser ablated features and method of fabricating154US 6,919,514 B2International Business Machines Corporation · 2005
- Method for manufacturing high-density multilayer printed circuit boards127US 6,119,338 AIndustrial Technology Research Institute · 2000