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US 2022/0223532 A1Published application
Wiring substrate
AssigneeIbiden Co., Ltd.
InventorsTomoyuki IKEDA, Yoshinori TAKENAKA
Life of this patent
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Abstract
A wiring substrate includes a core substrate, and a build-up part formed on the core substrate and including insulating layers and conductor layers. The conductor layers include one or more conductor layers each having a first wiring and a second wiring such that the second wiring has a conductor thickness smaller than a conductor thickness of the first wiring and that a minimum value of a line width of a wiring pattern of the second wiring is smaller than a minimum value of a line width of a wiring pattern of the first wiring.
Claims20
A wiring substrate, comprising:
- a core substrate;
- and
- a build-up part formed on the core substrate and comprising a plurality of insulating layers and a plurality of conductor layers,
- wherein the plurality of conductor layers includes at least one conductor layer having a first wiring and a second wiring such that the second wiring has a conductor thickness smaller than a conductor thickness of the first wiring and that a minimum value of a line width of a wiring pattern of the second wiring is smaller than a minimum value of a line width of a wiring pattern of the first wiring.
1 more element
Dependencies are inferred from the claim text.