Dual conductor laminated substrate
AssigneeGentherm Incorporated
InventorTimothy Hughes
Life of this patent
Estimating the term…
Abstract
A method for manufacturing a dual conductor laminated substrate includes providing a first laminate including a first insulating layer and a first conductive layer; defining a first trace pattern including one or more traces in the first laminate; providing a second laminate including a second insulating layer and a second conductive layer; defining a second trace pattern including one or more traces in the second laminate; defining access holes in the second insulating layer; at least one of depositing and stenciling a conductive material in the access holes of the second insulating layer; and aligning and attaching the first laminate to the second laminate to create a laminated substrate.
Claims24
A method for manufacturing a dual conductor laminated substrate, comprising:
- providing a first laminate including a first insulating layer and a first conductive layer;
- defining a first trace pattern including one or more traces in the first laminate;
- providing a second laminate including a second insulating layer and a second conductive layer;
- defining a second trace pattern including one or more traces in the second laminate;
- defining one or more access holes in the second insulating layer, the one or more access holes being in level with surfaces of the second insulating layer;
- at least one of depositing and stenciling a conductive material in the access holes of the second insulating layer;
- and
- aligning and attaching the first laminate to the second laminate to create a laminated substrate.
A method for manufacturing a dual conductor laminated substrate, comprising:
- providing a first laminate including a first insulating layer and a first conductive layer;
- defining a first trace pattern including one or more traces in the first laminate;
- providing a second laminate including a second insulating layer and a second conductive laver;
- defining a second trace pattern including one or more traces in the second laminate;
- defining access holes in the second insulating layer;
- at least one of depositing and stenciling a conductive material in the access holes of the second insulating layer;
- and
- aligning and attaching the first laminate to the second laminate to create a laminated substrate;
- wherein the first trace pattern defines overhanging portions relative to at least one of the access holes in the second insulating layer;
- and
- wherein the conductive material is arranged in the at least one of the access holes between opposite ends of adjacent overhanging portions in the second insulating layer.
A method for manufacturing a dual conductor laminated substrate, comprising:
- providing a first laminate including a first insulating layer and a first conductive layer;
- defining a first trace pattern including one or more traces in the first laminate;
- attaching a second insulating layer including one or more access holes to the first laminate, the one or more access holes being in level with surfaces of the second insulating layer, wherein the first trace pattern defines overhanging portions relative to at least one of the access holes in the second insulating layer;
- at least one of depositing and stenciling conductive material in the one or more access holes of the second insulating layer, the conductive material being in level with lower surface of the second insulating layer and lower portions of the one or more traces in the first laminate that are adiacent to the overhanging portions;
- providing a second laminate including a second conductive layer and a third insulating layer;
- defining a second trace pattern including one or more traces in the second laminate;
- and
- aligning and attaching the second laminate to the second insulating layer.
A method for manufacturing a dual conductor laminated substrate, comprising:
- providing a first laminate including a first insulating layer and a first conductive layer;
- defining a first trace pattern including one or more traces in the first laminate;
- attaching a second insulating layer including one or more access holes to the first laminate;
- at least one of depositing and stenciling conductive material in the one or more access holes of the second insulating layer;
- providing a second laminate including a second conductive layer and a third insulating laver;
- defining a second trace pattern including one or more traces in the second laminate;
- and
- aligning and attaching the second laminate to the second insulating layer;
- wherein the first trace pattern defines overhanging portions relative to at least one of the access holes in the second insulating layer;
- wherein the conductive material is arranged in the at least one of the access holes between opposite ends of adjacent overhanging portions in the second insulating layer;
- and
- wherein the conductive material is in level with lower surface of the second insulating layer and lower portions of the one or more traces in the first laminate that are adjacent to the overhanging portions.
Dependencies are inferred from the claim text.